Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

[Dr.sunilsingh]

REALME U1 RMX1831EX_11_A.08_190423

Release Date :- 23rd July, 2019

-: Software Information :-



System
· Added notification icons in status bar
· Added a new navigation gesture
· Added app drawer to ColorOS launcher
· Added Riding Mode
· Added Live Wallpaper
· Android Security Patch Level: May 5th, 2019

UI
· Updated UI of the notification panel
· Updated UI of AI Board
· Updated default theme

Camera
· Added Nightscape Mode

Applications
· Added realme Theme Store
· Added realme App Market (certain regions)
· Added realme Game Center (certain regions)





Download link is available in the Attachment URL

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​

 

[Dr.sunilsingh]

u1 ka file milega

REALME U1 RMX1831EX_11_A.08_190423

Release Date :- 23rd July, 2019

-: Software Information :-

https://www.martview-forum.com/thre...-recovered-handset-by-ufi-box.6674/post-47493​

 

[unlocker23]

please file dump

i need pls help

 

[wsmobile]

Vivo V15 pro done.

Connection status: IUSB3HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6532
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x8A1CCAB4
Manufacturing date: เธ.เธ. 2019
CID: 15010033 5636434D 42028A1C CAB4267A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.181203.001, version: 9 Pie (PKQ1.181203.001 release-keys)
build description: sm6150-user 9 PKQ1.181203.001 compiler07022226 release-keys

Internal storage: 108.95 GiB
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G

 

[cellbhai]

OPPO A3S CPH 1803 PATTERN AND FRP DONE
[ Open \\ISP Pinout picture ]
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x1753E929
Manufacturing date: Aug 2018
CID: 90014A68 42386150 3E031753 E929850C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\hB8aP_1753E929.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1803
brand: OPPO, model: CPH1803 (OPPO A3s)
build model list: CPH1803 (OPPO A3s)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1803EX_11_A.17)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190323.213841 release-keys
crypto state: encrypted?
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x1753E929
Manufacturing date: Aug 2018
CID: 90014A68 42386150 3E031753 E929850C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Done
Creating filesystem with parameters:
Size: 25497153536
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 6224891
Block groups: 190
Reserved block group size: 1024
Created filesystem with 11/1556480 inodes and 141728/6224891 blocks
Writing userdata... Done
Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x1753E929
Manufacturing date: Aug 2018
CID: 90014A68 42386150 3E031753 E929850C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0169
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x03, serial number: 0x1753E929
Manufacturing date: Aug 2018
CID: 90014A68 42386150 3E031753 E929850C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1803
brand: OPPO, model: CPH1803 (OPPO A3s)
build model list: CPH1803 (OPPO A3s)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1803EX_11_A.17)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190323.213841 release-keys
Internal storage: 23.75 GiB
crypto state: unencrypted

 

[ferouzkassim]

XIAOMI LAVENDER REDMINOTE 7 FLASH AND MI ACCOUNT RESET DONE BY CREDIT

Scanning for Qualcomm HS-USB QDLoader 9008 device...
Download Port: Qualcomm HS-USB QDLoader 9008 (COM150)
Connection status: XHCI:HUB3:
š(wUSB 2.00 High-Speed USB Driver: [Qualcomm Incorporated] qcusbser, version: 2.1.2.7, date: 8-2-2017
Initializing...
MSM Serial number: 0xb23daec9
MSM HW ID: 0x0008c0e1 (SDM660)
OEM Public Key Hash: 0xa7b8b82545a98eca23d6e9105fb464568d1b5828264903441bdef0cd57e3c370
SBL SW version: 4
Firehose: prog_emmc_firehose_Sdm660_ddr.elf
hash: efc889f69638209fdcc30d440e7ab52c5d848359, size: 653.91 KiB
QC_IMAGE_VERSION: BOOT.XF.1.4-00262-S660LZB-1
IMAGE_VARIANT: Sdm660LA
OEM_IMAGE_VERSION: c3-bsp-builder-job005.bj
Sending firehose loader... Done
Handshaking...
Sending ping... Done
Binary build date: Mar 25 2019 22:38:18
Chip serial num: 2990386889 (0xb23daec9)
Sending configurations...
ERROR: Only nop and sig tag can be recevied before authentication.
[SERVER] XIAOMI_FL [lavender,b23daec9] ref id: XF01106870538, cost: 4, your balance: 6
TargetName: MSM8996
MemoryName: eMMC
DateTime: Mar 25 2019 - 22:38:18
Version: 1
Firehose configured.
Storage type: eMMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x04, serial number: 0x0F67BCD3
Capacity: 116.50 GiB(125,086,728,192 bytes)
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 116.48 GiB(125,074,145,280 bytes)

Processing rawprogram0.xml
Writing PrimaryGPT at 0x00000000 (34 sectors)... Done
Writing vbmeta at 0x00020000 (8 sectors)... Done
Writing vbmetabak at 0x00030000 (8 sectors)... Done
Writing storsec at 0x00040000 (97 sectors)... Done
Writing storsecbak at 0x00060000 (97 sectors)... Done
Writing rpm at 0x00200000 (440 sectors)... Done
Writing rpmbak at 0x00280000 (440 sectors)... Done
Writing hyp at 0x00300000 (544 sectors)... Done
Writing hypbak at 0x00380000 (544 sectors)... Done
Writing pmic at 0x00400000 (78 sectors)... Done
Writing pmicbak at 0x00480000 (78 sectors)... Done
Writing cmnlib at 0x00500000 (434 sectors)... Done
Writing cmnlibbak at 0x00600000 (434 sectors)... Done
Writing cmnlib64 at 0x00700000 (536 sectors)... Done
Writing cmnlib64bak at 0x00800000 (536 sectors)... Done
Writing abl at 0x00900000 (296 sectors)... Done
Writing ablbak at 0x00A00000 (296 sectors)... Done
Writing devcfgbak at 0x00E00000 (96 sectors)... Done
Writing devcfg at 0x00F00000 (96 sectors)... Done
Writing tz at 0x01000000 (3848 sectors)... Done
Writing tzbak at 0x01400000 (3848 sectors)... Done
Writing mdtpsecapp at 0x01800000 (2108 sectors)... Done
Writing mdtpsecappbak at 0x01C00000 (2108 sectors)... Done
Writing keymaster at 0x02000000 (611 sectors)... Done
Writing keymasterbak at 0x02100000 (611 sectors)... Done
Writing bluetooth at 0x02200000 (1112 sectors)... Done
Writing xbl at 0x02500000 (5027 sectors)... Done
Writing xblbak at 0x02880000 (5027 sectors)... Done
Writing dsp at 0x05800000 (32768 sectors)... Done
Writing mdtp at 0x08000000 (34782 sectors)... Done
Writing dtbo at 0x0B000000 (16384 sectors)... Done
Writing dtbobak at 0x0B800000 (16384 sectors)... Done
Writing splash at 0x0C000000 (53189 sectors)... Done
Writing modem at 0x18000000 (224515 sectors)... Done
Writing boot at 0x2C000000 (131072 sectors)... Done
Writing recovery at 0x30000000 (131072 sectors)... Done
Writing cache at 0x34000000 (257 sectors)... Done
Writing system at 0x44000000 (6063369 sectors)... Done
Writing vendor at 0x124000000 (1499345 sectors)... Done
Writing cust at 0x1A4000000 (1371353 sectors)... Done
Writing userdata at 0x1D8000000 (69769 sectors)... Done
Writing BackupGPT at NUM_DISK_SECTORS-33. (33 sectors)... Done
Applying DISK patch... Done

Flashing completed in 2 mins 42.086 s






Scanning for Qualcomm HS-USB QDLoader 9008 device...
Download Port: Qualcomm HS-USB QDLoader 9008 (COM150)
Connection status: XHCI:HUB3:USB 2.00 High-Speed
USB Driver: [Qualcomm Incorporated] qcusbser, version: 2.1.2.7, date: 8-2-2017
Initializing...
Reset Xiaomi(MI Account) Lock... Done

 

[ferouzkassim]

OPPO A1K USER LOCK REMOVE DONE CPH1923 WITHOUT RISK


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x4572CEA6
Manufacturing date: Jan 2019
CID: 15010051 4436334D 42034572 CEA61662
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\QD63MB_4572CEA6.ext_csd"

ANDROID System Info:
platform: MT6765, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6762_18540, name: CPH1923
brand: OPPO, model: CPH1923 (OPPO A1k)
build model list: CPH1923 (OPPO A1k)
build id: PPR1.180610.011, version: 9 Pie (CPH1923EX_11_A.21)
build description: full_oppo6762_18540-user 9 PPR1.180610.011 eng.root.20190815.000557 release-keys

crypto state: encrypted?
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMQD60003M-BXXX/32G



Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QD63MB (0x514436334d42), rev: 0x03, serial number: 0x4572CEA6
Manufacturing date: Jan 2019
CID: 15010051 4436334D 42034572 CEA61662
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 29.12 GiB(31,268,536,320 bytes)

[Oppo] MasterClear [1]... Done

 

[Komar866]

Vivo V15 pro done.

Connection status: IUSB3HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-6532
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x8A1CCAB4
Manufacturing date: เธ.เธ. 2019
CID: 15010033 5636434D 42028A1C CAB4267A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: vivo
board: sm6150, name: sm6150
brand: vivo, model: vivo 1818
build model list: vivo 1818
build id: PKQ1.181203.001, version: 9 Pie (PKQ1.181203.001 release-keys)
build description: sm6150-user 9 PKQ1.181203.001 compiler07022226 release-keys

Internal storage: 108.95 GiB
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G

Link please dump file vivo v15 pro

 

[likkiunlocking]

Oppo F11 Pro [ CPH 1969 ] User Lock Done

Read Info

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Master Clear

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Thanks To UFi TEAM

 

[nilesh gangwal]

lenovo k8 note dead boot repair done by isp pinout

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[nilesh gangwal]

mi note 5 dead fix by ufi
chang emmc and programing by ufi

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[ferouzkassim]

oppo f9 password remove without data loss

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0xC8DBCAEB
Manufacturing date: Sep 2018
CID: 15010044 48364441 4202C8DB CAEB95DA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\DH6DAB_C8DBCAEB.ext_csd"

ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18311, name: CPH1823
brand: OPPO, model: CPH1823 (OPPO F9)
build model list: CPH1823 (OPPO F9)
build id: O11019, version: 8.1.0 Oreo (CPH1823EX_11_A.17_190612)
build description: full_oppo6771_18311-user 8.1.0 O11019 1560355186 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMDH6000DA-BXXX/64G


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DH6DAB (0x444836444142), rev: 0x02, serial number: 0xC8DBCAEB
Manufacturing date: Sep 2018
CID: 15010044 48364441 4202C8DB CAEB95DA
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

[Oppo] MasterClear [2]... Done

 

[Dr.sunilsingh]

u1 ka file milega

https://www.martview-forum.com/thre...-recovered-handset-by-ufi-box.6674/post-47493

 

[yasir90]

sir can u guide me
can i flash it new security by ufi box


Sent from my iPhone using GsmMarhaba

 

[nilesh gangwal]

samsung g532g dead boot fix by ufi isp pinout

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[nilesh gangwal]

Oppo realme 2 rmx1805
password and frp done without data loss by ufi

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[mdasif04]

REALME U1 RMX1831 UNLOCK WITHOUT ONLINE | REALME U1 UNLOCK TESTPOINT | RMX1831 PIN PASSWORD UNLOCK

NO ONLINE

REALME U1 ( RMX1831 ) FULL FIRMWARE- FLASH By UFI BOX

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firmware link

 

[ferouzkassim]

OPPO F9 CHINA MODEL USERDATA RESET DONE
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0786EA79
Manufacturing date: Sep 2018
CID: 13014E53 304A394B 39100786 EA799580
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\S0J9K9_0786EA79.ext_csd"

ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18011, name: PBCM00
brand: OPPO, model: PBCM00 (OPPO A7x)
build model list: PBBM00 (OPPO A7x)
build id: O11019, version: 8.1.0 Oreo (PBCM00_11_A.10_190112)
build description: full_oppo6771_18011-user 8.1.0 O11019 1547260687 release-keys

crypto state: encrypted?



Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x13 (Micron)
Product name: S0J9K9 (0x53304a394b39), rev: 0x10, serial number: 0x0786EA79
Manufacturing date: Sep 2018
CID: 13014E53 304A394B 39100786 EA799580
CSD: D05F0132 8F5913FF FFFFFFEF 964000A8
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,074,145,280 bytes)

[Oppo] MasterClear [1]... Done

 

[foneworld07]

oppo f11 pro successfully done with wipe data and clear frp.

 

[Deepesh Sharma]

Lg G3 Stylus (D690) Dead Recover Emcp Reprogram With Ufi-Box
Image

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Emcp FFu Update Only Ufi-Box Support For Bga-221Type

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Write Dump After Repair Emcp

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Emcp Reprogram Successfully

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Successfully Alive Handset

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