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Martview FX-01 Multifunctional

Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

Deepesh Sharma

Deepesh Sharma

Friend's Martview
Apr 4, 2017
1,712
3,157
India
Sonork ID
100.1614172
Micromax Q402+ Dead During Flashing By Other Technician
Emmc Repair+reprogram All Job Successfully Done With Ufi-Box
Device Error/Health Bad

Emmc Reprograme

After Repair Emmc Full Info.

Handset Alive Successfully
 
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Deepesh Sharma

Deepesh Sharma

Friend's Martview
Apr 4, 2017
1,712
3,157
India
Sonork ID
100.1614172
Last edited:
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Dr.sunilsingh

Dr.sunilsingh

Friend's Martview
Aug 2, 2018
402
823
india
Skype
[email protected]
Sonork ID
1681209
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Deepesh Sharma

Deepesh Sharma

Friend's Martview
Apr 4, 2017
1,712
3,157
India
Sonork ID
100.1614172
  • Like
Reactions: samzhen_23, ANDROID BOSS, prince aftab and 2 others
ferouzkassim

ferouzkassim

Active Member
Oct 11, 2018
51
34
Uganda
Skype
ferouz_kassim
oppo f11 pro offline job remove password done

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x484A6625
Manufacturing date: Feb 2019
CID: 90014A68 43386150 3E03484A 6625261C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x02
Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\hC8aP_484A6625.ext_csd"

ANDROID System Info:
platform: MT6771, cpu abi: arm64-v8a
manufacturer: OPPO
board: oppo6771_18531, name: CPH1969
brand: OPPO, model: CPH1969 (OPPO F11 Pro)
build model list: CPH1985 (OPPO R15), CPH1987 (OPPO F11 Pro), CPH1969 (OPPO F11 Pro)
build id: PPR1.180610.011, version: 9 Pie (CPH1969EX_11_A.23)
build description: full_oppo6771_18531-user 9 PPR1.180610.011 eng.root.20190824.180751 release-keys

crypto state: encrypted?
crypto state: encrypted?

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x484A6625
Manufacturing date: Feb 2019
CID: 90014A68 43386150 3E03484A 6625261C
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

[Oppo] MasterClear [1]... Done
 
ferouzkassim

ferouzkassim

Active Member
Oct 11, 2018
51
34
Uganda
Skype
ferouz_kassim
OPPO A5 (model: PBAM00 (OPPO A5)) CHINA VERSION USERDATA RESET DONE

NO ONLINE TOOL CAN DO ONLY OPTION IS THROUGH EMMC / ISP

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0x73C0DED3
Manufacturing date: Nov 2018
CID: 15010052 48363441 420573C0 DED3B5B0
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\RH64AB_73C0DED3.ext_csd"

ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: PBAM00
brand: OPPO, model: PBAM00 (OPPO A5)
build model list: PBAM00 (OPPO A5)
build id: OPM1.171019.026, version: 8.1.0 Oreo (PBAM00_11_A.18)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190330.172044 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMRH60014A-B614/64GB (BGA221)


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RH64AB (0x524836344142), rev: 0x05, serial number: 0x73C0DED3
Manufacturing date: Nov 2018
CID: 15010052 48363441 420573C0 DED3B5B0
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)

MasterClear [2]... Done
 
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ferouzkassim

ferouzkassim

Active Member
Oct 11, 2018
51
34
Uganda
Skype
ferouz_kassim
OPPO R15 (OPPO, model: PAAT00 (OPPO R15 )

CHINA VERSION USERDATA RESET DONE

NO ONLINE TOOL CAN DO ONLY OPTION IS THROUGH EMMC / ISP




Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x54BEC4D6
Manufacturing date: Apr 2018
CID: 15010033 5636434D 420254BE C4D64524
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\\%BACKUPS%\3V6CMB_54BEC4D6.ext_csd"

ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: PAAT00
brand: OPPO, model: PAAT00 (OPPO R15 梦镜版)
build model list: PAAM00 (OPPO R15 梦镜版)
build id: OPM1.171019.011, version: 8.1.0 Oreo (PAAT00_11_A.28)
build description: sdm660_64-user 8.1.0 OPM1.171019.011 eng.root.20190816.013703 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KM3V6000CM-BXXX/128G


Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4224
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 3V6CMB (0x335636434d42), rev: 0x02, serial number: 0x54BEC4D6
Manufacturing date: Apr 2018
CID: 15010033 5636434D 420254BE C4D64524
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 116.48 GiB(125,069,950,976 bytes)

MasterClear [2]... Done
 
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