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Post Success Reports Here Successfully Repaired/Dead Recovered Handset By Ufi Box

mbiborna

mbiborna

Active Member
Aug 26, 2017
30
7
bangladesh
J200H REPAIR DEAD BOOT SUCCESSFULLY

Insertion test... CMD, DAT0 not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t (0x483847347421), rev: 0x01, serial number: 0x16872D02
Manufacturing date: Jun 2016
CID: 90014A48 38473474 21011687 2D02631C
CSD: D07F0132 0F5903FF FFFFFFEF 8A400012
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 4 MiB [Authentication Key not yet programmed]
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x10
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: samsung
board: SC7730SE, name: j23gdd
brand: samsung, model: SM-J200H
build model list: SM-J200H
build id: LMY48B, version: 5.1.1 [Lollipop] (LMY48B.J200HXXU0APK1)
build description: j23gdd-user 5.1.1 LMY48B J200HXXU0APK1 release-keys
Internal storage: 5.47 GiB
Click to expand...
 
G

Gsm_john031

Junior Member
Jun 14, 2020
2
0
Philippines
Dr.sunilsingh said:
OPPO F11 ( CPH1911 ) Dead Handset ( Other Shop Return ) Successfully By UFI BOX










Dr.Research-Center-Team
Click to expand...
Sir i need file please share
 
mbiborna

mbiborna

Active Member
Aug 26, 2017
30
7
bangladesh
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xEEAB9AB2
Manufacturing date: Mar 2019
CID: 15010047 5036424D 4201EEAB 9AB236BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
MasterClear [2]... Done



Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xEEAB9AB2
Manufacturing date: Mar 2019
CID: 15010047 5036424D 4201EEAB 9AB236BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done



Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0xEEAB9AB2
Manufacturing date: Mar 2019
CID: 15010047 5036424D 4201EEAB 9AB236BC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x05
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 88365]
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Feature support: 0x55
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: PBAM00
brand: OPPO, model: PBAM00 (OPPO A5)
build id: OPM1.171019.026, version: 8.1.0 [Oreo] (PBAM00_11_A.34)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20210924.180317 release-keys
crypto state: encrypted?
eMMC selected: [SAMSUNG] KMGP6001BM-BXXX/64GB
 

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mbiborna

mbiborna

Active Member
Aug 26, 2017
30
7
bangladesh
Redmi 7
Click to expand...


Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0xC673017A
Manufacturing date: Feb 2019
CID: 90014A68 42386150 3E01C673 017A26FC
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
Device version: 0x420E
Firmware version: 0x32303030
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
[Xiaomi] Reset Mi Account Lock... Done
Click to expand...


Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0xC673017A
Manufacturing date: Feb 2019
CID: 90014A68 42386150 3E01C673 017A26FC
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
Device version: 0x420E
Firmware version: 0x32303030
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Clear FRP Lock... Done
Click to expand...


Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hB8aP (0x68423861503e), rev: 0x01, serial number: 0xC673017A
Manufacturing date: Feb 2019
CID: 90014A68 42386150 3E01C673 017A26FC
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
Device version: 0x420E
Firmware version: 0x32303030
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Secure Feature support: 0x55
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: msm8953, name: onc
brand: xiaomi, model: Redmi 7
build id: PKQ1.181021.001, version: 9 [Pie] (PKQ1.181021.001)
build description: onc-user 9 PKQ1.181021.001 V11.0.7.0.PFLMIXM release-keys
crypto state: encrypted?
Click to expand...
 
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