If You Have Any Problem Using UFI Box Or Any Problem Recover Set Post Here
- Thread starter Deepesh Sharma
- Start date
Firmware package: spesn_global_images_V13.0.2.0.SGKMIXM_20220622.0000.00_12.0_global
Scanning for Qualcomm HS-USB QDLoader 9008 device...
Download Port: Qualcomm HS-USB QDLoader 9008 (COM21)
Connection status: XHCI:HUB3[#1]:USB 2.10 High-Speed
USB Device: [Qualcomm CDMA Technologies MSM] QUSB_BULK_CID:043A_SN:28C1ED5A
USB Driver: [Qualcomm Incorporated] qcusbser:qcusbser.sys, version: 2.1.3.5, date: 12-17-2018
Initializing...
MSM Serial number: 0x28c1ed5a
MSM HW ID: 0x001b80e1 , OEM ID: 0x0072 (Xiaomi), MODEL ID: 0x0000
OEM Public Key Hash: 1bebe3863a6781db4b01086063007334de9e5ca14971c7c4f4358ec9d79cda4692ce5e948c6fd409408f4c919fcadfe3
SBL SW version: 1
Firehose: prog_firehose_ddr.elf
hash: 75d0c351b62e56715138525bb5c8fc40730e9a5e, size: 667.17 KiB
oem version: m1-xm-ota-bd151.bj.idc.xiaomi.com
qc version: BOOT.XF.4.1-00316-KAMORTALAZ-1.449341.1
variant: DivarPkgLAA
Loading firehose... Done
Handshaking...
Sending ping... Done
INFO: Binary build date: Jun 21 2022 21:33:13
INFO: Chip serial num: 683797850 (0x28c1ed5a)
Sending configurations...
Requesting flash signature from server...
[SERVER] Error: this version of software is outdated, please synchronize or get setup update from support !
ERROR: Only nop and sig tag can be recevied before authentication.
[SERVER] Error: this version of software is outdated, please synchronize or get setup update from support !
Synchronizing files...
Synchronize finished, files are now up-to-date.
Synchronizing files...
Synchronize finished, files are now up-to-date.
Scanning for Qualcomm HS-USB QDLoader 9008 device...
Download Port: Qualcomm HS-USB QDLoader 9008 (COM21)
Connection status: XHCI:HUB3[#1]:USB 2.10 High-Speed
USB Device: [Qualcomm CDMA Technologies MSM] QUSB_BULK_CID:043A_SN:28C1ED5A
USB Driver: [Qualcomm Incorporated] qcusbser:qcusbser.sys, version: 2.1.3.5, date: 12-17-2018
Initializing...
MSM Serial number: 0x28c1ed5a
MSM HW ID: 0x001b80e1 , OEM ID: 0x0072 (Xiaomi), MODEL ID: 0x0000
OEM Public Key Hash: 1bebe3863a6781db4b01086063007334de9e5ca14971c7c4f4358ec9d79cda4692ce5e948c6fd409408f4c919fcadfe3
SBL SW version: 1
Firehose: prog_firehose_ddr.elf
hash: 75d0c351b62e56715138525bb5c8fc40730e9a5e, size: 667.17 KiB
oem version: m1-xm-ota-bd151.bj.idc.xiaomi.com
qc version: BOOT.XF.4.1-00316-KAMORTALAZ-1.449341.1
variant: DivarPkgLAA
Loading firehose... Done
Handshaking...
Sending ping... Done
INFO: Binary build date: Jun 21 2022 21:33:13
INFO: Chip serial num: 683797850 (0x28c1ed5a)
Sending configurations...
Requesting flash signature from server...
[SERVER] Error: this version of software is outdated, please synchronize or get setup update from support !
ERROR: Only nop and sig tag can be recevied before authentication.
[SERVER] Error: this version of software is outdated, please synchronize or get setup update from support !
Synchronizing files...
Synchronize finished, files are now up-to-date.
Synchronizing files...
Synchronize finished, files are now up-to-date.
З даного продукту немає ні якого сенсу !!!
Авторизації немає на багато виробників пристроїв тільки на старі.
Дуже багато багів !!!
немає синхронізації програмного забезпечення
немає оновлення тільки фікси які нічого не роблять
сервер вже не працює
НЕ РЕКОМЕНДУЮ
Не викидайте гроші не вітер
Це звернення для користувачів форуму, а не для розробника
Авторизації немає на багато виробників пристроїв тільки на старі.
Дуже багато багів !!!
немає синхронізації програмного забезпечення
немає оновлення тільки фікси які нічого не роблять
сервер вже не працює
НЕ РЕКОМЕНДУЮ
Не викидайте гроші не вітер
Це звернення для користувачів форуму, а не для розробника
WHY CANT I FIX RPMB AND I CAN UPDATE EMMC
Connection status: XHCI:HUB3[#3]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8844-4946
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DC6DMB (0x444336444d42), rev: 0x00, serial number: 0xAD7A6AE0
Manufacturing date: Nov 2023
CID: 15010044 4336444D 4200AD7A 6AE0BA40
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 28084]
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Write Protect Information: 0x01
Secure Feature support: 0x55
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
userdata fs: unknown(encrypted?)
eMMC selected: [SAMSUNG] KMDC6001DM-BXXX/64GB
Connection status: XHCI:HUB3[#3]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8844-4946
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DC6DMB (0x444336444d42), rev: 0x00, serial number: 0xAD7A6AE0
Manufacturing date: Nov 2023
CID: 15010044 4336444D 4200AD7A 6AE0BA40
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 28084]
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Secure Write Protect Information: 0x01
Secure Feature support: 0x55
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
userdata fs: unknown(encrypted?)
eMMC selected: [SAMSUNG] KMDC6001DM-BXXX/64GB
Connection status: XHCI:HUB3[#3]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8844-4946
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DC6DMB (0x444336444d42), rev: 0x00, serial number: 0xAD7A6AE0
Manufacturing date: Nov 2023
CID: 15010044 4336444D 4200AD7A 6AE0BA40
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Scanning "/data" partition... Done
Factory Reset...
Creating filesystem with parameters:
Size: 209715200
Block size: 4096
Blocks per group: 32768
Inodes per group: 6400
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 51200
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/12800 inodes and 1867/51200 blocks
Writing cache... Wrote 999447939 blocks, expected to write 51200 blocks
Done
Creating filesystem with parameters:
Size: 51279560704
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 12519424
Block groups: 383
Reserved block group size: 1024
Created filesystem with 11/3131408 inodes and 242614/12519424 blocks
Writing userdata... Unknown chunk type 0x0000 at 0x00E0D0C4
Wrote 999462672 blocks, expected to write 12519424 blocks
Done
Done
Interface: UFI High-Speed
Serial number: 0011-8844-4946
Boot version: 1.05, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: DC6DMB (0x444336444d42), rev: 0x00, serial number: 0xAD7A6AE0
Manufacturing date: Nov 2023
CID: 15010044 4336444D 4200AD7A 6AE0BA40
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB
User area: 58.24 GiB(62,537,072,640 bytes)
Scanning "/data" partition... Done
Factory Reset...
Creating filesystem with parameters:
Size: 209715200
Block size: 4096
Blocks per group: 32768
Inodes per group: 6400
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 51200
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/12800 inodes and 1867/51200 blocks
Writing cache... Wrote 999447939 blocks, expected to write 51200 blocks
Done
Creating filesystem with parameters:
Size: 51279560704
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 12519424
Block groups: 383
Reserved block group size: 1024
Created filesystem with 11/3131408 inodes and 242614/12519424 blocks
Writing userdata... Unknown chunk type 0x0000 at 0x00E0D0C4
Wrote 999462672 blocks, expected to write 12519424 blocks
Done
Done