What is the difference in eMMC vs UFS
Some people ask about UFS, in fact, UFS (Universal Flash storage) has been known for quite a long time, but maybe some new colleagues are interested after finding symptoms of damage on various products, such as Xiaomi mi5, but apparently some friends don't know that UFS is not e -MMC, even though most UFSs currently circulating are similar to eMMC, which is BGA 153 (by colleagues it is assumed that e-MMC is, some colleagues try to connect to UFI's eMMC socket box, well, it can't be read) Hope this article can help a little.
Universal Flash Storage (UFS) or in its products also known as 3D NAND MEMORY, is applied technology on NAND's basic gate FLASH MEMORY, this technology seems to be present to replace the previous NAND MEMORY technology, e-MMC.
where we already know that e-MMC is a NAND acceleration technology with a built-in controller, UFS is still similar in this regard, namely a controller that will coordinate the communication protocol from NAND MEMORY to external HOST.
The most striking difference between e-MMC and UFS is:
1. Higher bandwidth capacity and faster interconnection/ interfaces/interfaces than logic cores on UFS compared to e-MMC
2. Can arrange a larger capacity in the same chip, so indeed this UFS trend is to provide 32 GB and more storage, in 3D technology - 32 layers, namely increasing the number of layers vertically, without having to have an impact on the size dimensions of the chip, using an average 9 x 9mm PoP or 8.5 x 11mm in large capacity, for example, 32 GB / 64 GB or even 128 GB.
3. Lower power consumption than the e-MMC architecture, because with this technology the power consumption is only on active / currently accessed NAND die, while others will enter sleep mode at an idle time.
4. If there is a limitation/lack of e-MMC, that is, it cannot perform reading and writing operations at the same time, then UFS can do it at the same time, so that some content operations will make the e-MMC feel limited to bandwidth, even on technology The last e-MMC, which is 5.1 only, this limitation will be felt when we talk about comparisons with UFS. Experience up to 33% higher bandwidth with our ultra-fast UFS products (versus thee. MMC 5.1 interface).
the most common packaging (currently) on NAND flash memory IC with this type of UFS, is TFBGA95 and TFBGA 153, all you need to remember is the self-contained packaging is 153, while 95 only uses a few, because it is usually stacked on top of the Samsung modem processor shannon333.
Benefits are certainly felt, such as faster memory access, such as processing the device itself, for example at boot time, when running various applications, or when syncing with a PC, on devices that use UFS as their storage.
prepared for the latest needs for large storage needs, but also must be accessible quickly. Of course, besides requiring a fast processor, a prime dual data rate Ram technology, we also need our storage to be able to be accessed quickly (everyday examples on personal computers in general, if you have used a super processor, with super ram, it will feel slow too if you still use HDD and not SSD) this might be a general idea why our mobile devices are also starting to switch to using faster storage.
Memory technology must keep up with the times, where not only the development of processors from devices, or applications, but RF technology also urges it there, for example when 5G technology is said to be much faster than current 4G / LTE-A transmit data technology which will support a variety of real virtual videos and many other super-fast internet communications with various applications. so with the development of technology from all sides simultaneously, it is hoped that bottleneck problems will not occur.
there are still a lot of discussions, wait, guys, I'll share the others later, while I'm attaching this:
- UFS BGA153 distribution pins
- Examples of products, UFS from several manufacturers
thank you,
Some people ask about UFS, in fact, UFS (Universal Flash storage) has been known for quite a long time, but maybe some new colleagues are interested after finding symptoms of damage on various products, such as Xiaomi mi5, but apparently some friends don't know that UFS is not e -MMC, even though most UFSs currently circulating are similar to eMMC, which is BGA 153 (by colleagues it is assumed that e-MMC is, some colleagues try to connect to UFI's eMMC socket box, well, it can't be read) Hope this article can help a little.
Universal Flash Storage (UFS) or in its products also known as 3D NAND MEMORY, is applied technology on NAND's basic gate FLASH MEMORY, this technology seems to be present to replace the previous NAND MEMORY technology, e-MMC.
where we already know that e-MMC is a NAND acceleration technology with a built-in controller, UFS is still similar in this regard, namely a controller that will coordinate the communication protocol from NAND MEMORY to external HOST.
The most striking difference between e-MMC and UFS is:
1. Higher bandwidth capacity and faster interconnection/ interfaces/interfaces than logic cores on UFS compared to e-MMC
2. Can arrange a larger capacity in the same chip, so indeed this UFS trend is to provide 32 GB and more storage, in 3D technology - 32 layers, namely increasing the number of layers vertically, without having to have an impact on the size dimensions of the chip, using an average 9 x 9mm PoP or 8.5 x 11mm in large capacity, for example, 32 GB / 64 GB or even 128 GB.
3. Lower power consumption than the e-MMC architecture, because with this technology the power consumption is only on active / currently accessed NAND die, while others will enter sleep mode at an idle time.
4. If there is a limitation/lack of e-MMC, that is, it cannot perform reading and writing operations at the same time, then UFS can do it at the same time, so that some content operations will make the e-MMC feel limited to bandwidth, even on technology The last e-MMC, which is 5.1 only, this limitation will be felt when we talk about comparisons with UFS. Experience up to 33% higher bandwidth with our ultra-fast UFS products (versus thee. MMC 5.1 interface).
the most common packaging (currently) on NAND flash memory IC with this type of UFS, is TFBGA95 and TFBGA 153, all you need to remember is the self-contained packaging is 153, while 95 only uses a few, because it is usually stacked on top of the Samsung modem processor shannon333.
Benefits are certainly felt, such as faster memory access, such as processing the device itself, for example at boot time, when running various applications, or when syncing with a PC, on devices that use UFS as their storage.
prepared for the latest needs for large storage needs, but also must be accessible quickly. Of course, besides requiring a fast processor, a prime dual data rate Ram technology, we also need our storage to be able to be accessed quickly (everyday examples on personal computers in general, if you have used a super processor, with super ram, it will feel slow too if you still use HDD and not SSD) this might be a general idea why our mobile devices are also starting to switch to using faster storage.
Memory technology must keep up with the times, where not only the development of processors from devices, or applications, but RF technology also urges it there, for example when 5G technology is said to be much faster than current 4G / LTE-A transmit data technology which will support a variety of real virtual videos and many other super-fast internet communications with various applications. so with the development of technology from all sides simultaneously, it is hoped that bottleneck problems will not occur.
there are still a lot of discussions, wait, guys, I'll share the others later, while I'm attaching this:
- UFS BGA153 distribution pins
- Examples of products, UFS from several manufacturers
thank you,
