SAMSUNG GALAXY J2 CORE
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7570_go, name: j2coreltecis
brand: samsung, model: SM-J260F
build model list: SM-J260F
build id: M1AJB, version: 8.1.0 Oreo (M1AJB.J260FXXS2ASD1)
build description: j2coreltecis-user 8.1.0 M1AJB J260FXXS2ASD1 release-keys
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\H8G4t2_C6340AC5.ext_csd"
READ DUMP FILE
IConnection status: EHCI:HUB:USB 2.00 High-Speed
nterface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Reading extcsd, size: 512 bytes...
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\ext_csd.bin" (CRC32: 0xE31A7A4D)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 1.551 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\boot1.bin" (CRC32: 0x3F7B1A64)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 1.553 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\boot2.bin" (CRC32: 0x70CD63F9)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 53.578 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\userarea_128MiB.bin" (CRC32: 0xC031BC22)
Blank checking: NOT blank
FRP REMOVE
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Clear FRP Lock... Done
DOWNLOAD DUMP
Edit : Blog Link Not Allowed Link Removed
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7570_go, name: j2coreltecis
brand: samsung, model: SM-J260F
build model list: SM-J260F
build id: M1AJB, version: 8.1.0 Oreo (M1AJB.J260FXXS2ASD1)
build description: j2coreltecis-user 8.1.0 M1AJB J260FXXS2ASD1 release-keys
crypto state: encrypted?
EXT_CSD backup saved to "\\%BACKUPS%\H8G4t2_C6340AC5.ext_csd"
READ DUMP FILE
IConnection status: EHCI:HUB:USB 2.00 High-Speed
nterface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Reading extcsd, size: 512 bytes...
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\ext_csd.bin" (CRC32: 0xE31A7A4D)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 1.551 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\boot1.bin" (CRC32: 0x3F7B1A64)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 1.553 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\boot2.bin" (CRC32: 0x70CD63F9)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 128 MiB... Done in 53.578 s
File saved to "\\%BACKUPS%\samsung\SM-J260F(M1AJB.J260FXXS2ASD1-8.1.0-M1AJB)[H8G4t2_C6340AC5]\userarea_128MiB.bin" (CRC32: 0xC031BC22)
Blank checking: NOT blank
FRP REMOVE
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0xC6340AC5
Manufacturing date: Jan 2019
CID: 90014A48 38473474 3201C634 0AC51674
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Clear FRP Lock... Done
DOWNLOAD DUMP
Edit : Blog Link Not Allowed Link Removed
Last edited by a moderator:
