- Jan 4, 2019
- 42
- 14
info------------------------
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1805
brand: OPPO, model: RMX1805 (realme 2)
build model list: RMX1809 (realme 2), RMX1811 (realme C1), RMX1805 (realme 2)
build id: PKQ1.190319.001, version: 9 Pie (RMX1805EX_11_A.60)
build description: S88051AA1-user 9 PKQ1.190319.001 eng.root.20190830.025347 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [1]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [2]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [3]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [5]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Wrote 70549436 blocks, expected to write 65536 blocks
Done
Creating filesystem with parameters:
Size: 25438433280
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 6210555
Block groups: 190
Reserved block group size: 1024
Created filesystem with 11/1553440 inodes and 141538/6210555 blocks
Writing userdata... Unknown chunk type 0x0000 at 0x00E0B0C4
Wrote 50411262 blocks, expected to write 6210555 blocks
Done
Done
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: RMX1805
brand: OPPO, model: RMX1805 (realme 2)
build model list: RMX1809 (realme 2), RMX1811 (realme C1), RMX1805 (realme 2)
build id: PKQ1.190319.001, version: 9 Pie (RMX1805EX_11_A.60)
build description: S88051AA1-user 9 PKQ1.190319.001 eng.root.20190830.025347 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [1]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [2]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [3]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
MasterClear [5]... failed
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x18A16894
Manufacturing date: Jun 2018
CID: 15010047 4436424D 420118A1 68946574
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Wrote 70549436 blocks, expected to write 65536 blocks
Done
Creating filesystem with parameters:
Size: 25438433280
Block size: 4096
Blocks per group: 32768
Inodes per group: 8176
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 6210555
Block groups: 190
Reserved block group size: 1024
Created filesystem with 11/1553440 inodes and 141538/6210555 blocks
Writing userdata... Unknown chunk type 0x0000 at 0x00E0B0C4
Wrote 50411262 blocks, expected to write 6210555 blocks
Done
Done