PPD CPU Heating Platform for IC Chip Heating De-gumming and De-tinning
Buy at below link : PPD CPU Heating Platform for IC Chip Heating De-gumming and De-tinning - MartviewCLICK HERE
Features:
A key of heating, rapid heating, the temperature can be adjusted 160~250℃, support multi-generation Apple, Huawei chip glue removal, tin removal work
Applicable to 99% of the chips on the market, 20*18.5mm work area, support for multi-generation Apple cell phones, Huawei cell phone chip universal hard disk, and CPU de-gumming and de-tinning
When heating, the temperature can be adjusted between 160℃, and 250℃, to effectively avoid burning the chip due to high temperature or improper adjustment
Air gun heating is safer than 100 lower than the air gun temperature scraping, free iron heating without repeated scraping of iron, and no damage to the pad
After heating to a set temperature, use a face-to-face sign to clean the residual tin without damaging the pad paint, non-absorbent tin belt back to wipe, and wear the chip for a long time
Fast heating, no leakage, no static electricity, safer, curve heating, built-in professional adjustment curve, no need to worry about thermal stress caused by chip damage
Hidden screw, flexible and lightweight, flexible telescopic clamping while hidden screw to prevent residue falling into the screw, more durable and better use