New Martview RB-03 BGA Reballing Stencil Set for iPhone / Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA

[Martview]

Martview RB-03 BGA Reballing Stencil Set for iPhone / Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA​

Buy at below link : Martview RB-03 BGA Reballing Stencil Set for iPhone / Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA - Martview
CLICK HERE

Features:

• Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• High precision, no burrs, so that every mesh can be of the same size and not stuck
• Selected steel has strong toughness and is not easy to deform at high temperature
• Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin

Stencil Specification:
IP A8-A17 CPU 10pcs Stencil Features:

• Support A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 CPU RAM (iPhone 6/6 plus, iPhone 6S/6s plus, iPhone 7/7 plus, iPhone 8/8 plus, iPhone X/XS/XS Max/XR, iPhone 11/11Pro/11Pro Max, iPhone 12 mini/12/12 Pro/12 Pro Max, iPhone 13 mini/13/13 Pro/13 Pro Max, iPhone 14/14 Plus/14 Pro/14 Pro Max, iPhone 15/15 Plus/15 Pro/15 Pro Max)
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

For Qualcomm Snapdragon Series CPU (21pcs) Support Model: New!

• RB03-QT 1 For Qualcomm Snapdragon 210 MSM8909
• RB03-QT 2 For Qualcomm Snapdragon 410 MSM8916,615 MSM8939
• RB03-QT 3 For Qualcomm Snapdragon 425 MSM8917
• RB03-QT 4 For Qualcomm Snapdragon 430 MSM8937, 435 MSM8940
• RB03-QT 5 For Qualcomm Snapdragon 460 SM4250, 662 SM6115
• RB03-QT 6 For Qualcomm Snapdragon 625 MSM8953 1AB
• RB03-QT 7 For Qualcomm Snapdragon SDM450/632 MSM8953 B01
• RB03-QT 8 For Qualcomm Snapdragon 636 SDM636, 660 SDM660
• RB03-QT 9 For Qualcomm Snapdragon 765G SM7250
• RB03-QT 10 For Qualcomm Snapdragon 778G SM7315/7325
• RB03-QT 11 For Qualcomm Snapdragon 820 MSM8996
• RB03-QT 12 For Qualcomm Snapdragon 835 MSM8998
• RB03-QT 13 For Qualcomm Snapdragon 845 SMD845
• RB03-QT 14 For Qualcomm Snapdragon 855 SM8150
• RB03-QT 15 For Qualcomm Snapdragon 865/870 SM8250-002 Big
• RB03-QT 16 For Qualcomm Snapdragon 865 SM8250-102 Smal
• RB03-QT 17 For Qualcomm Snapdragon 888 SM8350
• RB03-QT 18 For Qualcomm Snapdragon 888 SM8350 Anti-short Circuit Net
• RB03-QT 19 For Qualcomm Snapdragon 8Gen1 SM8450
• RB03-QT 20 For Qualcomm Snapdragon 8Gen2 SM8550
• RB03-QT 21 For Qualcomm Snapdragon 7+Gen2 SM7475, 8+Gen1 SM8475/8425
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

For Hisilicon Kirin Series CPU (18pcs) Support Model: New!

• RB03-HI 1 For Hisilicon Kirin 620 HI6220
• RB03-HI 2 For Hisilicon Kirin 659 HI6250
• RB03-HI 3 For Hisilicon Kirin 710 HI6260 V100
• RB03-HI 4 For Hisilicon Kirin 710 HI6260 V101
• RB03-HI 5 For Hisilicon Kirin 810 HI6280
• RB03-HI 6 For Hisilicon Kirin 820/985 HI6290/L
• RB03-HI 7 For Hisilicon Kirin 960 HI3660
• RB03-HI 8 For Hisilicon Kirin 970 HI3670
• RB03-HI 9 For Hisilicon Kirin 980 HI3680
• RB03-HI 10 For Hisilicon Kirin 990 HI3690 5G
• RB03-HI 11 For Hisilicon Kirin HI9500 V100
• RB03-HI 12 For Hisilicon Kirin 9000 HI36A0
• RB03-HI 13 For Hisilicon Kirin 9000S HI36A0-V120
• RB03-HI 14 For Hisilicon HI6260 RAM
• RB03-HI 15 For Hisilicon HI3660 RAM
• RB03-HI 16 For Hisilicon HI3670/80/90 RAM
• RB03-HI 17 For Hisilicon HI36A0 RAM
• RB03-HI 18 For Hisilicon Kirin 990 HI3690 4G
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

For MTK Dimensity Series CPU (10pcs) Support Model: New!

• RB03-MT 1 For MTK Dimensity MT6768V/6769V
• RB03-MT 2 For MTK Dimensity 700/810 MT6833V
• RB03-MT 3 For MTK Dimensity 720 MT6853V
• RB03-MT 4 For MTK Dimensity 800 MT6873V, 820 MT6875V
• RB03-MT 5 For MTK Dimensity 900/1080 MT6877V
• RB03-MT 6 For MTK Dimensity 1000 MT6889Z, 1000L MT6885Z
• RB03-MT 7 For MTK Dimensity 1100 MT6891Z, 1200 MT6893Z
• RB03-MT 8 For MTK Dimensity 8100 MT6895Z
• RB03-MT 9 For MTK Dimensity 9000 MT6983Z
• RB03-MT 10 For MTK Dimensity 9200 MT6985W
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

For Samsung Exynos Series CPU (10pcs) Support Model: New!

• RB03-EX 1 For Samsung Exynos Exynos 2100
• RB03-EX 2 For Samsung Exynos Exynos 2200/E9925
• RB03-EX 3 For Samsung Exynos Exynos 7884/7885/7904
• RB03-EX 4 For Samsung Exynos Exynos 880/980
• RB03-EX 5 For Samsung Exynos Exynos 8895
• RB03-EX 6 For Samsung Exynos Exynos 9609
• RB03-EX 7 For Samsung Exynos Exynos 9610/9611
• RB03-EX 8 For Samsung Exynos Exynos 9815/1080
• RB03-EX 9 For Samsung Exynos Exynos 9820
• RB03-EX 10 For Samsung Exynos Exynos 990
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

EMMC UFS 7pcs Stencil Features:

• Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 BGA297 all size
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

Universal BGA 7pcs Stencil Features:

• P:0.3 50X50: Spacing:0.3
• P:0.35 50X50: Spacing:0.35
• P:0.4 50X50: Spacing:0.4
• P:0.5 50X50: Spacing:0.5
• P:0.35 45° 50X50: Spacing:0.35
• P:0.4 45° 50X50: Spacing:0.4
• P:0.4 D 50X50: Spacing:0.4
• Size: 63mm x 63mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

0.5-1.5MM Universal 12pcs Stencil Features:
This stencil is used for Solder Balls

• 0.25MM P:0.5: Solder Balls size: 0.25mm Spacing:0.5
• 0.3MM P:0.58: Solder Balls size: 0.3mm Spacing:0.58
• 0.35MM P:0.65: Solder Balls size: 0.35mm Spacing:0.65
• 0.4MM P:0.7: Solder Balls size: 0.4mm Spacing:0.7
• 0.45MM P:0.78: Solder Balls size: 0.45mm Spacing:0.78
• 0.5MM P:0.8: Solder Balls size: 0.5mm Spacing:0.8
• 0.55MM P:1.02: Solder Balls size: 0.55mm Spacing:1.02
• 0.6MM P:0.9: Solder Balls size: 0.6mm Spacing:0.9
• 0.6MM P:1.0: Solder Balls size: 0.6mm Spacing:1.0
• 0.6MM P:1.1: Solder Balls size: 0.6mm Spacing:1.1
• 0.76MM P:1.27: Solder Balls size: 0.76mm Spacing:1.27
• 1.0MM P:1.5: Solder Balls size: 1.0mm Spacing:1.5
• Size: 63mm x 63mm
• Stencil net thickness: 0.2mm
• Circular hole

More models of stencil net keeping update......