Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8842-2763
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0x3BF9F6BC
Manufacturing date: Oct 2018
CID: 90014A48 38473474 32013BF9 F6BCA502
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Not defined <<<<<<<<< <<<<<HELP ME FOR THESE PROBLEM
Estimation of the device lifetime (MLC): 0% - 10% device life time used
Interface: UFI High-Speed
Serial number: 0011-8842-2763
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCC, VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G4t2 (0x483847347432), rev: 0x01, serial number: 0x3BF9F6BC
Manufacturing date: Oct 2018
CID: 90014A48 38473474 32013BF9 F6BCA502
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Not defined <<<<<<<<< <<<<<HELP ME FOR THESE PROBLEM
Estimation of the device lifetime (MLC): 0% - 10% device life time used
