Huawei Honor 7s DUA-L22 Dead Boot Repair UFi Box
Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4404
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG4a2 (0x484147346132), rev: 0xD4, serial number: 0x32FB3A28
Manufacturing date: Nov 2018
CID: 90014A48 41473461 32D432FB 3A28B598
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6739, cpu abi: arm64-v8a
manufacturer: HUAWEI
board: DUA-L22, name: DUA-L22
brand: HONOR, model: DUA-L22
build model list: DUA-L22
build id: HONORDUA-L22, version: 8.1.0 Oreo (DUA-L22 1.0.0.104(C185))
build description: "DUA-L22-user 8.1.0 HONORDUA-L22 1.0.0.104(C185) release-keys"
Internal storage: 10.97 GiB
crypto state: unencrypted
Selected: [HYNIX] H9TQ17ADFTACUR/16GB+LPDDR3 24Gb (BGA221)
