Connection status: IUSB3HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-1107
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RX14MB (0x525831344d42), rev: 0x07, serial number: 0xD8C6CAB8
Manufacturing date: Jan 2017
CID: 15010052 5831344D 4207D8C6 CAB814A2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): 60% - 70% device life time used
Estimation of the device lifetime (MLC): 60% - 70% device life time used
moviNAND Smart report:
Error Mode: 0x00010C01 (Invalid)
THIS EMMC IS OK OR NOT ?
Interface: UFI High-Speed
Serial number: 0011-8841-1107
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RX14MB (0x525831344d42), rev: 0x07, serial number: 0xD8C6CAB8
Manufacturing date: Jan 2017
CID: 15010052 5831344D 4207D8C6 CAB814A2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): 60% - 70% device life time used
Estimation of the device lifetime (MLC): 60% - 70% device life time used
moviNAND Smart report:
Error Mode: 0x00010C01 (Invalid)
THIS EMMC IS OK OR NOT ?
