HOT FRT Tool Supported Chipset: Helio Series, Dimensity Series, Qualcomm Snapdragon Series, UNISOC Series ·············

FRT Tool · Sunday at 5:13 PM

Smartphone processors from ARMv5 to ARMv8 (2003–2019)

ARMv5

Model number	CPU	Fab	CPU	CPU cache	GPU	Memory technology	Wireless radio technologies	Released
MT6205	ARM7 (ARMv5)						GSM
MT6216				No GPU		GSM/GPRS Class 12 MODEM
MT6217				No GPU		GSM/GPRS Class 12 MODEM
MT6218B		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6219		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6223		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6225				No GPU		GSM/GPRS Class 12 MODEM
MT6226		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6227		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6228		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6229		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6230		Up to 52 MHz	16 KB Instruction-Cache, 16 KB Data-Cache	No GPU	8-bit or 16-bit up to 64 MB	GSM/GPRS Class 12 MODEM	2003
MT6235	ARM9 (ARMv5)		Up to 208 MHz		No GPU	8-bit or 16-bit up to 128 MB	GSM/GPRS/EDGE, Bluetooth	2007
MT6516	65 nm	416 MHz		No GPU		Not 3G compatible	2009

ARMv6

Model number	CPU (ISA)	fab	CPU	CPU cache	GPU	Memory technology	Wireless radio technologies	Released
MT6513	ARM11 (ARMv6)	65nm	650MHz		PowerVR SGX531 @ 281MHz		Not 3G compatible (MT6573 without 3G)
MT6573	650MHz		PowerVR SGX531 @ 281MHz		3G, HSPA	2010

ARMv7 - Single Core

Model number	CPU ISA	fab	CPU	CPU cache	GPU	Memory technology	Wireless radio technologies	Released
MT6575M	Cortex-A9 (ARMv7)		1.0GHz	256KB L2	PowerVR SGX531 @ 281MHz		3G, HSPA	2012
MT6515	40nm	1.0GHz		PowerVR SGX531 Ultra @ 522MHz		Not 3G compatible (MT6575 without 3G)	2012
MT6575	1.0GHz	512KB L2	PowerVR SGX531 Ultra @ 522MHz		3G, HSPA	2011

ARMv7 - Dual-core

Model number	CPU ISA	fab	CPU	CPU cache	GPU	Memory technology	Wireless radio technologies	Released
MT6517	ARMv7	40nm	1.0GHz dual-core		PowerVR SGX531 Ultra @ 522MHz		Not 3G compatible (MT6577 without 3G)	2012
MT6517T	1.2GHz dual-core		PowerVR SGX531 Ultra @ 525MHz		Not 3G compatible (MT6577T without 3G)
MT6570	28nm	1.3GHz dual-core ARM Cortex-A7		Mali-400 MP1		GSM/EDGE (2G), Multi-mode Rel. 8 HSPA+/TD-SCDMA (3G), Wi-Fi, FM, Bluetooth, GPS	2015
MT6571	1.3GHz dual-core ARM Cortex-A7		Mali-400 MP1		GSM/EDGE (2G), Wi-Fi, FM, Bluetooth, GPS	Q3 2014
MT6572	1.4GHz dual-core ARM Cortex-A7	32KB L1, 256KB L2	Mali-400 MP1 @ 500MHz	LPDDR2 266MHz	Multi-mode Rel. 8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	June 2013
MT6572M	1.0GHz dual-core ARM Cortex-A7	32KB L1, 256KB L2	Mali-400 MP1 @ 400MHz		GSM/EDGE (2G), Multi-mode Rel. 8 HSPA+/TD-SCDMA (3G), Wi-Fi, FM, Bluetooth, GPS	2014
MT6577	40nm	1.0GHz dual-core		PowerVR SGX531 Ultra @ 522MHz		3G, HSPA, HSPA+	2012
MT6577T	1.2GHz dual-core		PowerVR SGX531 Ultra @ 522MHz		3G, HSPA, HSPA+

ARMv7 - Quad-core

Model Number	CPU ISA	Fab	CPU	CPU Cache	GPU	Memory Technology	Wireless Radio Technologies	Released
MT6580	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.3 GHz	32 KB L1, 512 KB L2	Mali-400 MP1 @ 500 MHz	32-bit single-channel LPDDR2/LPDDR3 (533 MHz)	R8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	2015
MT6582M	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.3 GHz	32 KB L1, 512 KB L2	Mali-400 MP2 @ 400 MHz	32-bit single-channel LPDDR2/LPDDR3 (533 MHz)	R8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	Q1 2014
MT6582	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.3 GHz	32 KB L1, 512 KB L2	Mali-400 MP2 @ 500 MHz	32-bit single-channel LPDDR2/LPDDR3 (533 MHz)	R8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	Q3 2013
MT6589M	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.2 GHz	32 KB L1, 1 MB L2	PowerVR SGX544MP @ 156 MHz	LPDDR2/LPDDR3	3G, HSPA+, TD-SCDMA	July 2013
MT6589	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.2 GHz	32 KB L1, 1 MB L2	PowerVR SGX544MP @ 286 MHz	32-bit single-channel LPDDR2 (533 MHz)	3G, HSPA+, TD-SCDMA	March 2013
MT6589T	ARMv7	28nm	Quad-core ARM Cortex-A7 @ up to 1.5 GHz	32 KB L1, 1 MB L2	PowerVR SGX544MP @ 357 MHz	LPDDR1/LPDDR2	3G, HSPA+, TD-SCDMA	July 2013
MT6588	ARMv7	28nm (TSMC 28HPM)	Quad-core ARM Cortex-A7 @ up to 1.7 GHz	32 KB L1, 1 MB L2	Mali-450 MP4 @ 600 MHz	LPDDR2 533 MHz, LPDDR3 666 MHz	R8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	Q4 2013

ARMv7 - Hexa-core and octa-core

Model number	CPU ISA	Fab	CPU	CPU Cache	GPU	Memory Technology	Wireless Radio Technologies	Released
MT6591	ARMv7	28 nm (TSMC 28HPM)	1.5 GHz hexa-core ARM Cortex-A7		Mali-450 MP4 @ 600 MHz	32-bit single-channel LPDDR2, LPDDR3	GSM, GPRS, UMTS, HSPA+, HSUPA, TD-SCDMA	Q1 2014
MT6592M	1.4 GHz octa-core ARM Cortex-A7	32 KB L1, 1 MB L2	Mali-450 MP4 @ 600 MHz	32-bit single-channel LPDDR2 533 MHz (4.3 GB/s), LPDDR3 666 MHz (5.3 GB/s)	R8 HSPA+/TD-SCDMA, Wi-Fi, FM, Bluetooth, GPS	2014
MT6592	1.7–2 GHz octa-core ARM Cortex-A7	32 KB L1, 1 MB L2	Mali-450 MP4 @ 700 MHz	Q4 2013
MT6595M	2.0 GHz quad-core ARM Cortex-A17 and 1.5 GHz quad-core ARM Cortex-A7 (ARM big.LITTLE with GTS)	32 KB L1, 2 MB L2	PowerVR G6200 (2 clusters) @ 450 MHz	32-bit dual-channel 933 MHz LPDDR3 (14.9 GB/sec)	WCDMA, TD-SCDMA, GSM, FDD/TDD-LTE, CMCC 3G, CMCC 4G and TD-LTE	Q1 2014
MT6595	2.2 GHz quad-core Cortex-A17 and 1.7 GHz quad-core Cortex-A7 (ARM big.LITTLE with GTS)	32 KB L1, 2 MB L2	PowerVR G6200 (2 clusters) @ 600 MHz	Q1 2014

ARMv8 - Quad Core

Model Number	CPU ISA	Fab	CPU	GPU	Memory Technology	Wireless Radio Technologies	Released
MT6731	ARMv8-A (64-bit)	28 nm	1.1 GHz quad-core ARM Cortex-A53	PowerVR GE8100 @ 350 MHz	32-bit single-channel 667 MHz LPDDR2/3 up to 512 MB	GSM, UMTS, GPRS, HSPA+, HSUPA, LTE Cat 4	Q1 2019
MT6735P / MT6735M	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.0 GHz quad-core ARM Cortex-A53	Mali-T720 MP2 @ 400 (P)/500 (M) MHz	32-bit single-channel 533 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 4	Q2 2015
MT6735	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.3 GHz quad-core ARM Cortex-A53	Mali-T720 MP2 @ 600 MHz	32-bit single-channel 640 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 4	Q2 2015
MT6737	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.1-1.3 GHz quad-core ARM Cortex-A53	Mali-T720 MP2 @ 550–650 MHz	32-bit single-channel 640 MHz LPDDR2/3 up to 3 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 4 VoLTE	Q2 2016
MT6737T	ARMv8-A (64-bit)	28 nm	1.5 GHz quad-core ARM Cortex-A53	Mali-T720 MP2 @ 600 MHz	32-bit single-channel 733 MHz LPDDR2/3 up to 3 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 4 VoLTE	Q2 2016
MT6732M	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.3 GHz quad-core ARM Cortex-A53	Mali-T760 MP2 @ 500 MHz	32-bit single-channel 800 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q3 2014
MT6732	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.5 GHz quad-core ARM Cortex-A53	Mali-T760 MP2 @ 500 MHz	32-bit single-channel 800 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q3 2014
MT6738	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2 @ 350 MHz	32-bit single-channel 667 MHz LPDDR3 up to 4 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 6	2016
MT6738T	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2 @ 520 MHz	32-bit single-channel 667 MHz LPDDR3 up to 4 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, EVDO, LTE Cat 6	2016
MT6739	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.5 GHz quad-core ARM Cortex-A53	PowerVR GE8100 @ 570 MHz	32-bit single-channel 667 MHz LPDDR3 (6.4 GB/sec) up to 3 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q4 2017

ARMv8 - Octa Core

Model Number	CPU ISA	Fab	CPU	GPU	Memory Technology	Wireless Radio Technologies	Released
MT6750	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	1.0 GHz quad-core ARM Cortex-A53 1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2 @ 520 MHz	32-bit single-channel 666 MHz LPDDR3 up to 4 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA, VoLTE	Q2 2016
MT6750N	28 nm (TSMC 28HPM)	1.0 GHz quad-core ARM Cortex-A53 1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2 @ >520 MHz			Q1 2018
MT6753	28 nm LPM	1.3 GHz quad-core ARM Cortex-A53 1.5 GHz quad-core ARM Cortex-A53	Mali-T720 MP3 @ 700 MHz	32-bit single-channel 666 MHz LPDDR3 up to 3 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 4 FDD and TD-LTE	Q3 2015
MT6750T	28 nm (TSMC 28HPM)	1.0 GHz quad-core ARM Cortex-A53 1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2 @ 650 MHz	32-bit single-channel 833 MHz LPDDR3 up to 4 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA, VoLTE	Q2 2016
MT6750S	28 nm (TSMC 28HPM)	1.0 GHz quad-core ARM Cortex-A53 1.5 GHz quad-core ARM Cortex-A53	Mali-T860 MP2	32-bit single-channel 833 MHz LPDDR3 up to 4 GB	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA, VoLTE	Q1 2018
MT6752M	28 nm (TSMC 28HPM)	1.5 GHz octa-core ARM Cortex-A53	Mali-T760 MP2 @ 700 MHz	32-bit single-channel 800 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q3 2014
MT6752	28 nm (TSMC 28HPM)	1.7 GHz octa-core ARM Cortex-A53	Mali-T760 MP2 @ 700 MHz	32-bit single-channel 800 MHz LPDDR3 (6.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q3 2014

FRT Tool · Sunday at 8:47 PM

Helio Series

Helio X Series (2014–2017)

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	Wireless radio technologies	Released
Helio X10 MT6795M/6795/6795T	ARMv8-A (64-bit)	28 nm (TSMC 28HPM)	4 × Cortex-A53 @ 2.0/2.2 GHz 4 × Cortex-A53 @ 1.2 GHz	PowerVR G6200 @ 550/700 MHz	64-bit (2×32-bit) Dual-channel 933 MHz LPDDR3 (14.9 GB/sec)	—	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4	Q4 2014
Helio X20 MT6797	20 nm (TSMC 20SoC)	2 × Cortex-A72 @ 2.1 GHz 4 × Cortex-A53 @ 1.85 GHz 4 × Cortex-A53 @ 1.4 GHz	Mali-T880 MP4 @ 780 MHz	32-bit dual-channel 800 MHz LPDDR3	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q4 2015
Helio X23 MT6797D	20 nm (TSMC 20SoC)	2 × Cortex-A72 @ 2.3 GHz 4 × Cortex-A53 @ 1.85 GHz 4 × Cortex-A53 @ 1.4 GHz	Mali-T880 MP4 @ 800 MHz	32-bit dual-channel 800 MHz LPDDR3	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q1 2017
Helio X25 MT6797T	20 nm (TSMC 20SoC)	2 × Cortex-A72 @ 2.5 GHz 4 × Cortex-A53 @ 2 GHz 4 × Cortex-A53 @ 1.55 GHz	Mali-T880 MP4 @ 800 MHz	32-bit dual-channel 800 MHz LPDDR3	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q4 2015
Helio X27 MT6797X	20 nm (TSMC 20SoC)	2 × Cortex-A72 @ 2.6 GHz 4 × Cortex-A53 @ 2 GHz 4 × Cortex-A53 @ 1.6 GHz	Mali-T880 MP4 @ 875 MHz	32-bit dual-channel 800 MHz LPDDR3	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q1 2017
Helio X30 MT6799	10 nm (TSMC 10FF)	2 × Cortex-A73 @ 2.6 GHz 4 × Cortex-A53 @ 2.2 GHz 4 × Cortex-A35 @ 1.9 GHz	PowerVR 7XTP-MT4 @ 850 MHz	4 × 16-bit LPDDR4x @ 1866 MHz (29.9 GB/s)	Cadence Tensilica P5 DSP	FDD-LTE / TD-LTE / TD-SCDMA / WCDMA / CDMA / GSM Cat 10 (DL = 450 Mbit/s, 3 × 20 MHz CA, 64-QAM) (UL = 150 Mbit/s, 2 × 20 MHz CA, 64-QAM)	Q2 2017

Helio A Series (2018–2020)

Model number	CPU ISA	fab	CPU	GPU	Memory technology	Wireless radio technologies	Released
Helio A20 MT6761V/WE	ARMv8-A (64-bit)	12 nm (TSMC 12FFC)	1.8 GHz quad-core ARM Cortex-A53	PowerVR GE8300 @ 550 MHz	64-bit, 800 MHz (LPDDR3) 1200 MHz (LPDDR4)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 6, CDMA2000 1x/EVDO Rev. A (SRLTE)	Q1 2020
Helio A22 MT6761V/WAB MT6761V/WBB	2.0 GHz quad-core ARM Cortex-A53	PowerVR GE8300 @ 660 MHz	64-bit, 933 MHz (LPDDR3) 1600 MHz (LPDDR4x)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 7 (DL) & Cat 13 (UL), CDMA2000 1x/EVDO Rev. A (SRLTE)	Q2 2018
Helio A25 MT6762V/WB MT6762V/WD	4 × 1.8 GHz ARM Cortex-A53 4 × 1.5 GHz ARM Cortex-A53	PowerVR GE8320 @ 600 MHz	64-bit, 933 MHz (LPDDR3) 1200 MHz (LPDDR4) 1600 MHz (LPDDR4x)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, LTE Cat 4, CDMA2000 1x/EVDO Rev. A (SRLTE)	Q4 2019

Helio P Series (2015–2020)

Helio G Series (2019–present)

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	Wireless radio technologies	Released
Helio P10 MT6755/MT6755M	ARMv8-A (64-bit)	28 nm (TSMC 28HPC+)	4 × Cortex-A53 @ 2.0/1.8 GHz 4 × Cortex-A53 @ 1.2/1.0 GHz	Mali-T860 MP2 @ 700 MHz	32-bit single-channel 933 MHz LPDDR3 (7.4 GB/sec)	—	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q4 2015
Helio P15 MT6755T	28 nm (TSMC 28HPC+)	4 × Cortex-A53 @ 2.2 GHz 4 × Cortex-A53 @ 1.2 GHz	Mali-T860 MP2 @ 700 MHz	32-bit single-channel 933 MHz LPDDR3 (7.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q3 2016
Helio P18 MT6755S	28 nm (TSMC 28HPC+)	4 × Cortex-A53 @ 2.0 GHz 4 × Cortex-A53 @ 1.4 GHz	Mali-T860 MP2 @ 800 MHz	32-bit single-channel 933 MHz LPDDR3 (7.4 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q1 2018
Helio P20 MT6757	16 nm (TSMC 16FF+)	4 × Cortex-A53 @ 2.3 GHz 4 × Cortex-A53 @ 1.6 GHz	Mali-T880 MP2 @ 900 MHz	16-bit dual-channel 1600 MHz LPDDR4x (12.8 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q3 2016
Helio P25/P25T MT6757CD/6757T	16 nm (TSMC 16FF+)	4 × Cortex-A53 @ 2.4/2.6 GHz 4 × Cortex-A53 @ 1.65/1.7 GHz	Mali-T880 MP2 @ 1.0 GHz	16-bit dual-channel 1600 MHz LPDDR4x (12.8 GB/sec)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q2 2017
Helio P22 MT6762	12 nm (TSMC 12FFC)	4 × Cortex-A53 @ 2.0 GHz 4 × Cortex-A53 @ 1.5 GHz	IMG PowerVR GE8320 @ 650 MHz	LPDDR3 @ 933 MHz (Max 4 GB), LPDDR4x @ 1600 MHz (Max 6 GB)	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 7 FDD and TD-LTE w/ 20+20 CA, Dual 4G LTE DSDS with Dual VoLTE/ViLTE	Q2 2018
Helio P23/P23T MT6763/6763T	16 nm (TSMC 16FF+)	4 × Cortex-A53 @ 2.3 GHz / 2.5 GHz (single-core scenario) 4 × Cortex-A53 @ 1.65 GHz	Mali-G71 MP2 @ 770 MHz	16-bit dual-channel @ 1600 MHz LPDDR4X	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA, Dual 4G LTE DSDS with Dual VoLTE/ViLTE	Q3 2017
Helio P30 MT6758	16 nm (TSMC 16FF+)	4 × Cortex-A53 @ 2.3 GHz 4 × Cortex-A53 @ 1.65 GHz	Mali-G71 MP2 @ 950 MHz + VPU	16-bit dual-channel @ 1600 MHz LPDDR4X	Cadence Tensilica Vision P5 DSP @ 500 MHz	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat 6 FDD and TD-LTE w/ 20+20 CA	Q3 2017
Helio P35 MT6765	12 nm (TSMC 12FFC)	4 × Cortex-A53 @ 2.3 GHz 4 × Cortex-A53 @ 1.8 GHz	PowerVR GE8320 @ 680 MHz	Dual-channel LPDDR4x @ 1600 MHz		Q4 2018
Helio P60 MT6771	12 nm (TSMC 12FFC)	4 × Cortex-A73 @ 2.0 GHz 4 × Cortex-A53 @ 2 GHz	Mali-G72 MP3 @ 800 MHz	Dual-channel LPDDR4x @ 1800 MHz	2 × Cadence Tensilica Vision P6 DSP @ 525 MHz	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, Cat-7 (DL) / Cat-13 (UL); Dual 4G VoLTE; TAS 2.0; Global IMS	Q1 2018

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Helio G25 MT6762G	ARMv8-A (64-bit)	12 nm (TSMC 12FFC)	4 × Cortex-A53 @ 2.0 GHz 4 × Cortex-A53 @ 1.5 GHz	PowerVR GE8320 @ 650 MHz	LPDDR3 @ 933 MHz, LPDDR4X @ 1600 MHz	Unknown	21 MP Single Camera at 30 fps 13 MP+8 MP Dual Camera at 30 fps	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, LTE Cat-4, Cat-7 (DL) / Cat-13 (UL); Dual 4G VoLTE; TAS 2.0; Global IMS, Bluetooth 5.0	Q2 2020
Helio G35 MT6765G	4 × Cortex-A53 @ 2.3 GHz 4 × Cortex-A53 @ 1.8 GHz	PowerVR GE8320 @ 680 MHz	25 MP Single Camera at 30 fps 13 MP+13 MP Dual Camera at 30 fps
Helio G36 MT6765V/XBA	4 × Cortex-A53 @ 2.2 GHz 4 × Cortex-A53 @ 1.8 GHz	50 MP Single Camera at 15 fps 25 MP Single Camera at 30 fps 13 MP+13 MP Dual Camera at 30 fps	Q1 2023
Helio G37 MT6765H	4 × Cortex-A53 @ 2.3 GHz 4 × Cortex-A53 @ 1.8 GHz	Q4 2021
Helio G70 MT6769V/CB	ARMv8.2-A (64-bit)	2 × Cortex-A75 @ 2.0 GHz 6 × Cortex-A55 @ 1.7 GHz	Mali G52 MC2 @ 820 MHz	Dual-channel LPDDR4X @ 1800 MHz	48 MP Single Camera / 25 MP Single Camera at 30 fps 16 MP+16 MP Dual Camera at 30 fps	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, LTE Cat-7 (DL) / Cat-13 (UL); Dual 4G VoLTE; TAS 2.0; Global IMS, Bluetooth 5.0	Q1 2020
Helio G80 MT6769T MT6769V/CT MT6769V/CU	2 × Cortex-A75 @ 2.0 GHz 6 × Cortex-A55 @ 1.8 GHz	Mali-G52 MC2 @ 950 MHz
Helio G85 MT6769Z MT6769V/CZ	Mali-G52 MC2 @ 1.0 GHz	Q2 2020
Helio G88 MT6769H	64 MP Single Camera 16 MP+16 MP Dual Camera at 30 fps	Q3 2021
Helio G91 MT6769G	108 MP Single Camera 16 MP+16 MP Dual Camera at 30 fps	Q1 2024
Helio G90 MT6785V/CD	2 × Cortex-A76 @ 2.05 GHz 6 × Cortex-A55 @ 2.0 GHz	Mali-G76 MC4 @ 720 MHz	Dual-channel LPDDR4X @ 2133 MHz	2 × APU 1 TOPS	48 MP Single Camera at 30 fps 24 MP+16 MP Dual Camera at 30 fps	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, LTE Cat-12 (DL) / Cat-13 (UL); Dual 4G VoLTE; TAS 2.0; Global IMS, Bluetooth 5.0, 4×4 MIMO	Q3 2019
Helio G90T MT6785V/CC	Mali-G76 MC4 @ 800 MHz	64 MP Single Camera at 22.5 fps 48 MP Single Camera at 30 fps 24 MP+16 MP Dual Camera at 30 fps
Helio G95 MT6785V/CD	Mali-G76 MC4 @ 900 MHz	Q3 2020
Helio G96 MT6781 MT6781V/CD	Mali-G57 MC2 @ 950 MHz	Unknown	108 MP Single Camera / 32 MP Single Camera at 30 fps with ZSL 16 MP+16 MP Dual Camera at 30 fps with ZSL	GSM, UMTS, GPRS, HSPA+, HSUPA, TD-SCDMA, CDMA2000 1x/EVDO Rev. A, LTE Cat-13; Dual 4G VoLTE; TAS 2.0; Global IMS, Bluetooth 5.2, 4×4 MIMO	Q3 2021
Helio G99 MT6789 MT6789G MT6789U MT6789V/CD MT8781 MT8781V/CA MT8781V/NA	6 nm (TSMC N6)	2 × Cortex-A76 @ 2.2 GHz 6 × Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 1.0 GHz	Q2 2022
Helio G100	Mali-G57 MC2	200 MP Single Camera / 32 MP Single Camera at 30 fps with ZSL 16 MP+16 MP Dual Camera at 30 fps with ZSL	Q3 2024

FRT Tool · Sunday at 8:53 PM

Dimensity Series (2020–present)

Dimensity 700 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	ISP	Wireless radio technologies	Released
Dimensity 700[44] (MT6833 MT6833G MT6833V/ZA MT6833V/NZA)	ARMv8.2-A (64-bit)	7 nm (TSMC N7)	2× Cortex-A76 @ 2.2 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 950 MHz (121.6 GFLOPS in FP32)	2 × 16-bit LPDDR4x @ 2133 MHz (17.1 GB/s)	64 MP Single Camera / 16 MP+16 MP Dual Camera at 30 fps	5G NR Sub-6 GHz, LTE	Q1 2021
Dimensity 720[45] (MT6853V/ZA MT6853V/NZA)	2× Cortex-A76 @ 2.0 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC3 @ 730 MHz (140.2 GFLOPS in FP32)	64 MP Single Camera / 20 MP+16 MP Dual Camera at 30 fps	Q3 2020

Dimensity 800 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 800U[46] (MT6853T MT6853V/TNZA)	ARMv8.2-A (64-bit)	7 nm (TSMC N7)	2× Cortex-A76 @ 2.4 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC3 @ 950 MHz (182.4 GFLOPS in FP32)	2 × 16-bit LPDDR4x @ 2133 MHz (17.1 GB/s)	APU 3.0 (Three Cores) 2.4 TOPS	64 MP Single Camera / 20 MP+16 MP Dual Camera at 30 fps	5G NR Sub-6 GHz, LTE	Q3 2020
Dimensity 800[47] (MT6873)	4× Cortex-A76 @ 2.0 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G57 MC4 @ 748 MHz (191.5 GFLOPS in FP32)	64 MP Single Camera / 32 MP+16 MP Dual Camera at 30 fps	Q2 2020
Dimensity 810[48] (MT6833P MT6833GP MT6833V/PNZA)	6 nm (TSMC N6)	2× Cortex-A76 @ 2.4 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 1068 MHz (136.7 GFLOPS in FP32)	Facial Recognition Engine	64 MP Single Camera / 16 MP+16 MP Dual Camera at 30 fps	Q3 2021
Dimensity 820[49] (MT6875)	7 nm (TSMC N7)	4× Cortex-A76 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G57 MC5 @ 900 MHz (288 GFLOPS in FP32)	APU 3.0 (Three Cores) 2.4 TOPS	80 MP Single Camera / 32 MP+16 MP Dual Camera at 30 fps	Q2 2020

Dimensity 900 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 900[50] (MT6877 MT6877V/ZA)	ARMv8.2-A (64-bit)	6 nm (TSMC N6)	2× Cortex-A78 @ 2.4 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G68 MC4 @ 900 MHz (230.4 GFLOPS in FP32)	LPDDR4X, LPDDR5	3rd Generation MediaTek APU	108 MP Single Camera / 20 MP+20 MP Dual Camera at 30 fps	5G NR Sub-6 GHz, LTE	Q2 2021
Dimensity 920[51] (MT6877 MT6877T MT6877V/TZA)	2× Cortex-A78 @ 2.5 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G68 MC4 @ 950 MHz (243.2 GFLOPS in FP32)	Q3 2021
Dimensity 930[52] (MT6855 MT6855V/AZA)	2× Cortex-A78 @ 2.2 GHz 6× Cortex-A55 @ 2.0 GHz	IMG BXM-8-256 @ 950 MHz		108 MP Single Camera	Q3 2022

Dimensity 1000 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 1000C (MT6883Z/CZA)	ARMv8.2-A (64-bit)	7 nm (TSMC N7)	4× Cortex-A77 @ 2.0 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G57 MC5 @ 654 MHz (209.3 GFLOPS in FP32)	4 × 16-bit LPDDR4x @ 1866 MHz (29.9 GB/s)	APU 3.0 (Four Cores)	Photo: 64 MP, 32 MP+16 MP Video: 4K HDR	5G NR Sub-6 GHz, LTE, Wi-Fi 5 (2×2), Bluetooth 5.1, dual-band GNSS	Q3 2020
Dimensity 1000L (MT6885Z/CZA)	4× Cortex-A77 @ 2.2 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC7 @ 695 MHz (311.4 GFLOPS in FP32)	APU 3.0 (2x big, 3x small and 1x tiny) 4.5 TOPS	Photo: 80 MP, 32 MP+16 MP Video: 4K HDR	5G NR Sub-6 GHz, LTE, Wi-Fi 6 (2×2), Bluetooth 5.1, dual-band GNSS	Q1 2020
Dimensity 1000 (MT6889)	4× Cortex-A77 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC9 @ 836 MHz (481.5 GFLOPS in FP32)
Dimensity 1000+ (MT6889Z/CZA)	Q2 2020
Dimensity 1050 (MT6879 MT6879V/ZA MT6879V_T/ZA)	6 nm (TSMC N6)	2× Cortex-A78 @ 2.5 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G610 MC3 @ 1.0 GHz (384 GFLOPS in FP32)	LPDDR4X, LPDDR5	MediaTek APU 550	Photo: 108 MP, 20 MP+20 MP Video: 4K30 HDR	5G NR Sub-6 GHz, 5G mmWave, LTE, Wi-Fi 6 (2×2), Bluetooth 5.2, dual-band GNSS	Q3 2022
Dimensity 1080 (MT6877 MT6877V/TTZA MT6877V_T/TTZA)	2× Cortex-A78 @ 2.6 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G68 MC4 @ 950 MHz (243.2 GFLOPS in FP32)	MediaTek APU 3.0	Photo: 200 MP Video: 4K30 HDR	5G NR Sub-6 GHz, LTE, Wi-Fi 6 (2×2), Bluetooth 5.2, dual-band GNSS	Q4 2022
Dimensity 1100 (MT6891 MT6891Z/CZA MT6891Z_Z/CZA)	4× Cortex-A78 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC9 @ 836 MHz (481.5 GFLOPS in FP32)	4 × 16-bit LPDDR4x @ 2133 MHz (34.1 GB/s)	APU 3.0 (2x big, 3x small and 1x tiny) 4.5 TOPS	Photo: 108 MP, 32 MP+16 MP Video: 4K HDR	Q1 2021
Dimensity 1200 (MT6893 MT6893Z/CZA MT6893Z_A/CZA)	1× Cortex-A78 @ 3.0 GHz 3× Cortex-A78 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC9 @ 886 MHz (510.3 GFLOPS in FP32)	Photo: 200 MP, 32 MP+16 MP Video: 4K HDR
Dimensity 1300 (MT6893Z MT6893Z_T/CZA)	Q2 2022

Dimensity 6000 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	ISP	Wireless radio technologies	Released
Dimensity 6020 (Dimensity 700 renamed)	ARMv8.2-A (64-bit)	7 nm (TSMC N7)	2× Cortex-A76 @ 2.2 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 950 MHz (121.6 GFLOPS in FP32)	2 × 16-bit LPDDR4X @ 2133 MHz (17.1 GB/s)	Photo: 64 MP, 16+16 MP Video: 2K30	5G NR Sub-6 GHz, LTE, dual-band GNSS, Wi-Fi 5 (1×1), Bluetooth 5.1	Q1 2023
Dimensity 6080 (Dimensity 810 renamed)	6 nm (TSMC N6)	2× Cortex-A76 @ 2.4 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 1068 MHz (136.7 GFLOPS in FP32)		Photo: 108 MP, 16+16 MP
Dimensity 6100+ (MT6835 MT6835V/ZA MT8755V/TZB)	2× Cortex-A76 @ 2.2 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 962 MHz (123.1 GFLOPS in FP32)		5G NR Sub-6 GHz, LTE, dual-band GNSS, Wi-Fi 5 (1×1), Bluetooth 5.2	Q3 2023
Dimensity 6300 (MT6835T)	2× Cortex-A76 @ 2.4 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G57 MC2 @ 1072 MHz (137.2 GFLOPS in FP32)		Q2 2024

Dimensity 7000 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 7020 (Dimensity 930 renamed)	ARMv8.2-A (64-bit)	6 nm (TSMC N6)	2× Cortex-A78 @ 2.2 GHz 6× Cortex-A55 @ 2.0 GHz	IMG BXM-8-256 @ 950 MHz	LPDDR4X, LPDDR5		Photo: 108 MP Video: 2K30	5G NR Sub-6 GHz, 4G LTE, dual-band GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 5 (1×1), Bluetooth 5.2	Q1 2023
Dimensity 7025	2× Cortex-A78 @ 2.5 GHz 6× Cortex-A55 @ 2.0 GHz	Photo: 200 MP Video: 2K30	Q2 2024
Dimensity 7030 (Dimensity 1050 renamed)	Mali-G610 MC3 @ 1.0 GHz (384 GFLOPS in FP32)	MediaTek APU 550	MediaTek Imagiq 760 Photo: 108 MP / 20 MP+20 MP Video: 4K30 HDR	5G NR Sub-6 GHz & mmWave, 4G LTE, dual-band GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.2	Q3 2023
Dimensity 7050 (Dimensity 1080 renamed)	2× Cortex-A78 @ 2.6 GHz 6× Cortex-A55 @ 2.0 GHz	Mali-G68 MC4 @ 950 MHz (243.2 GFLOPS in FP32)	MediaTek APU 3.0	Photo: 200 MP Video: 4K30 HDR	5G NR Sub-6 GHz, 4G LTE, dual-band GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6 (2×2), Bluetooth 5.2	Q2 2023
Dimensity 7200 (MT6886 MT6886V_A/CZA MT6886V_B/CZA)	ARMv9-A (64-bit)	4 nm (TSMC N4P)	2× Cortex-A715 @ 2.8 GHz 6× Cortex-A510 @ 2.0 GHz	Mali-G610 MC4 @ 1.13 GHz (578.6 GFLOPS in FP32)	4 × 16-bit LPDDR4X @ 2133 MHz (34.1 GB/s) LPDDR5 @ 3200 MHz (51.2 GB/s)	MediaTek APU 650	MediaTek Imagiq 765 Photo: 200 MP Video: 4K30 HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.3	Q1 2023
Dimensity 7300 (MT6878)	ARMv8.2-A (64-bit)	4 nm (TSMC N4)	4× Cortex-A78 @ 2.5 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G615 MC2 @ 1047 MHz (536.1 GFLOPS in FP32)	MediaTek APU 655	MediaTek Imagiq 950 Photo: 200 MP Video: 4K30 HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.4	Q2 2024
Dimensity 7300X
Dimensity 7350	ARMv9-A (64-bit)	4 nm (TSMC N4P)	2× Cortex-A715 @ 3.0 GHz 6× Cortex-A510 @ 2.0 GHz	Mali-G610 MC4 @ 1.3 GHz (665.6 GFLOPS in FP32)	MediaTek APU 657	MediaTek Imagiq 765 Photo: 200 MP Video: 4K30 HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.3	Q3 2024

Dimensity 8000 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 8000	ARMv8.2-A (64-bit)	5 nm (TSMC N5)	4× Cortex-A78 @ 2.75 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G610 MC6 @ 700 MHz (537.6 GFLOPS in FP32)	4 × 16-bit LPDDR5 @ 3200 MHz (51.2 GB/s)	MediaTek APU 580	MediaTek Imagiq 780 Photo: 200 MP, 32 MP+32 MP+16 MP Video: 4K HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.3	Q1 2022
Dimensity 8020 (Dimensity 1100 renamed)	6 nm (TSMC N6)	4× Cortex-A78 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC9 @ 836 MHz (481.5 GFLOPS in FP32)	4 × 16-bit LPDDR4X @ 2133 MHz (34.1 GB/s)	MediaTek APU 570	Photo: 108 MP, 32 MP+16 MP Video: 4K HDR	5G NR Sub-6 GHz, 4G LTE, dual-band GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6 (2×2), Bluetooth 5.2	Q2 2023
Dimensity 8050 (Dimensity 1300 renamed)	1× Cortex-A78 @ 3.0 GHz 3× Cortex-A78 @ 2.6 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G77 MC9 @ 886 MHz (510.3 GFLOPS in FP32)	Photo: 200 MP, 32 MP+16 MP Video: 4K HDR
Dimensity 8100	5 nm (TSMC N5)	4× Cortex-A78 @ 2.85 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G610 MC6 @ 860 MHz (660.5 GFLOPS in FP32)	4 × 16-bit LPDDR5 @ 3200 MHz (51.2 GB/s)	MediaTek APU 580	MediaTek Imagiq 780 Photo: 200 MP, 32 MP+32 MP+16 MP Video: 4K HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.3	Q1 2022
Dimensity 8200	4 nm (TSMC N4)	1× Cortex-A78 @ 3.1 GHz 3× Cortex-A78 @ 3.0 GHz 4× Cortex-A55 @ 2.0 GHz	Mali-G610 MC6 @ 950 MHz (729.6 GFLOPS in FP32)	MediaTek Imagiq 785 Photo: 320 MP, 32 MP+32 MP+32 MP Video: 4K60 HDR	Q4 2022
Dimensity 8250	Q2 2024
Dimensity 8300	ARMv9-A (64-bit)	4 nm (TSMC N4P)	1× Cortex-A715 @ 3.35 GHz 3× Cortex-A715 @ 3.2 GHz 4× Cortex-A510 @ 2.2 GHz	Mali-G615 MC6 @ 1400 MHz (1075.2 GFLOPS in FP32)	4 × 16-bit LPDDR5X @ 4266.5 MHz (68.2 GB/s)	MediaTek APU 780	MediaTek Imagiq 980 Photo: 320 MP, 32 MP+32 MP+32 MP Video: 4K60 HDR	5G NR Sub-6 GHz, 4G LTE, GNSS (GPS, BeiDou, Glonass, Galileo, QZSS, NavIC), Wi-Fi 6E (2×2), Bluetooth 5.4	Q4 2023

Dimensity 9000 Series

Model number	CPU ISA	fab	CPU	GPU	Memory technology	APU (AI Processing Unit)	ISP	Wireless radio technologies	Released
Dimensity 9000	ARMv9-A (64-bit)	4 nm (TSMC N4)	1× Cortex-X2 @ 3.05 GHz 3× Cortex-A710 @ 2.85 GHz 4× Cortex-A510 @ 1.8 GHz	Mali-G710 MC10 @ 848 MHz (1085.4 GFLOPS in FP32)	4 × 16-bit (64-bit) LPDDR5-6400 @ 3200 MHz (51.2 GB/s) LPDDR5X-7500 @ 3750 MHz (60.0 GB/s)	MediaTek APU 590	MediaTek Imagiq 790 Photo: 320 MP Video: 4K HDR	5G NR (Sub-6 GHz), 4G LTE, tri-band GNSS (BeiDou, Galileo, GLONASS, GPS, NavIC, QZSS), Bluetooth 5.3, Wi-Fi 6E (2×2)	Q4 2021
Dimensity 9000+	1× Cortex-X2 @ 3.2 GHz 3× Cortex-A710 @ 2.85 GHz 4× Cortex-A510 @ 1.8 GHz	Mali-G710 MC10 @ 848 or 950 MHz (1085.4 or 1216 GFLOPS in FP32)	Q2 2022
Dimensity 9200	4 nm (TSMC N4P)	1× Cortex-X3 @ 3.05 GHz 3× Cortex-A715 @ 2.85 GHz 4× Cortex-A510 @ 1.8 GHz	Immortalis-G715 MC11 @ 981 MHz (2762.5 GFLOPS in FP32)	4 × 16-bit (64-bit) LPDDR5X-8533 @ 4266.5 MHz (68.2 GB/s)	MediaTek APU 690	MediaTek Imagiq 890 Photo: 320 MP Video: 8K30 HDR, 4K60 HDR	5G NR (Sub-6 GHz & mmWave), 4G LTE, quad-band GNSS (BeiDou, Galileo, GLONASS, GPS, NavIC, QZSS), Bluetooth 5.3, Wi-Fi 7 (2×2)	Q4 2022
Dimensity 9200+	1× Cortex-X3 @ 3.35 GHz 3× Cortex-A715 @ 3.0 GHz 4× Cortex-A510 @ 2.0 GHz	Immortalis-G715 MC11 @ 981 MHz or 1.15 GHz (2762.5 or 3238.4 GFLOPS in FP32)	Q2 2023
Dimensity 9300	ARMv9.2-A (64-bit)	4 nm (TSMC N4P)	1× Cortex-X4 @ 3.25 GHz 3× Cortex-X4 @ 2.85 GHz 4× Cortex-A720 @ 2.0 GHz	Immortalis-G720 MC12 @ 1300 MHz (3993.6 GFLOPS in FP32)	4 × 16-bit (64-bit) LPDDR5T-9600 @ 4800 MHz (76.8 GB/s)	MediaTek APU 790	MediaTek Imagiq 990 Photo: 320 MP Video: 8K30 HDR, 4K60 HDR	5G NR (Sub-6 GHz & mmWave), 4G LTE, quad-band GNSS (BeiDou, Galileo, GLONASS, GPS, NavIC, QZSS), Bluetooth 5.4, Wi-Fi 7 (2×2)	Q4 2023
Dimensity 9300+	1× Cortex-X4 @ 3.4 GHz 3× Cortex-X4 @ 2.85 GHz 4× Cortex-A720 @ 2.0 GHz	Q2 2024

FRT Tool · Sunday at 9:58 PM

Qualcomm Snapdragon systems on chips

Qualcomm Snapdragon

Physical specifications
Architecture and classification
General information
Launched	2007; 17 years ago
Designed by	Qualcomm
Application	Mobile SoC and 2-in-1 PC
Microarchitecture	ARM9, ARM11, ARM Cortex-A, Cortex-X1, Cortex-X2, Cortex-X3, Cortex-X4, Scorpion, Krait, Kryo, Oryon
Instruction set	ARMv6, ARMv7-A, ARMv8-A, ARMv9-A
Cores	1, 2, 4, 6, or 8

This is a list of Qualcomm Snapdragon systems on chips (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

Before Snapdragon

SoC made by Qualcomm before it was renamed to Snapdragon.[1]

MSM7xxx
MSM6xxx
QSC6xxx
QSC1xxx
Model number	Fab	CPU	GPU (or Gfx Core)	Connectivity	Sampling availability
QSC1100					Q4 2007
QSC6010		ARMv5TEJ ARM926EJ-S[citation needed]	No 3D and ARM 2D	None	2006
QSC6020
QSC6030
QSC6240			HSDPA	Q3 2007
QSC6245-1			HSDPA	Q3 2007
QSC6055				Q1 2007
QSC6065			HSDPA	Q2 2007
QSC6260-1				Q3 2007
QSC6270			HSDPA
QSC6075				Q2 2007
QSC6085			DOrA	Q4 2007
MSM6000				None	2006
MSM6025
MSM6050
MSM6100			ARM-DSP 3D and ARM 2D
MSM6125
MSM6150			Defender2 3D and ARM 2D
MSM6175
MSM6225			No 3D and ARM 2D	HSDPA
MSM6250			ARM-DSP 3D and ARM 2D	WCDMA	2006
MSM6250A			No 3D and ARM 2D	WCDMA
MSM6245			WEDGE
MSM6255A
MSM6260		ARMv5TEJ ARM926EJ-S @ 225 MHz[2]	ARM-DSP 3D and ARM 2D	HSUPA
MSM6275			Defender2 3D and ARM 2D
MSM6280
MSM6280A			Stargate 3D and ARM 2D	2007
MSM6800A			Defender3 3D and ARM 2D	DOrA	2006
MSM6575			DOr0
MSM6550		ARMv5TEJ ARM926EJ-S @ 225 MHz[3]	Defender2 3D and ARM 2D
MSM6550A
MSM6800			DOrA
MSM6500		ARMv5TEJ ARM926EJ-S @ 150 MHz[4]	ARM-DSP 3D and ARM 2D	DOr0
MSM7200			Imageon 3D Imageon 2D	HSUPA	2006
MSM7200A		ARM11 @ 528 MHz	Q1 2007
MSM7201[5][6]				2008
MSM7500			DOrA	2006
MSM7500A			Q4 2007
MSM7600	65 nm	ARM1136J-S @ 528 MHz[5][6]	HSUPA and DOrA	Q1 2007
MSM7850			LT 3D and LT 2D	DOrB	2008

Snapdragon S series

Snapdragon S1 notable features over its predecessor (MSM7xxx):

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S1

CPUfeatures
- 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11
- Up to 256K L2 cache
- Up to 32K+32K L1 cache
GPUfeatures
- Adreno 200 (From Software rendered or Adreno130)
  - OpenGL ES 1.1
  - OpenVG 1.0
  - Direct3D Mobile
  - Unified shader model 5-way VLIW
DSPfeatures
- Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz
ISPfeatures
- Up to 12 MP camera
Modem and wirelessfeatures
- External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models
45 or 65 nm manufacturing technology[7]

Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7225[8]	65 nm	1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache	Software rendered 2D support (HVGA)	Hexagon QDSP5 320 MHz	Up to 5 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0	2007
MSM7625[8]	CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227[8]	1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache	Adreno 200 226 MHz (FWVGA)	Up to 8 MP camera	LPDDR Single-channel 166 MHz (1.33 GB/s)	UMTS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0	2008
MSM7627[8]	CDMA/UMTS; GSM
MSM7225A[8]	45 nm	1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (HVGA)	Hexagon QDSP5 350 MHz	Up to 5 MP camera	LPDDR Single-channel 200 MHz (1.6 GB/s)	UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0	Q4 2011
MSM7625A[8]	CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A[8]	1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 245 MHz (FWVGA)	Up to 8 MP camera	UMTS, MBMS; GSM
MSM7627A[8]	CDMA2000/UMTS, MBMS; GSM
MSM7225AB[8][9][10]	UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250[8]	65 nm	1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache	Adreno 200 226 MHz (WXGA)	Hexagon QDSP6 600 MHz	Up to 12 MP camera	LPDDR Single-channel 400 MHz	UMTS, MBMS; GSM	Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0	Q4 2008
QSD8650[8]	CDMA2000/UMTS, MBMS; GSM

Snapdragon S2 notable features over its predecessor (Snapdragon S1):
Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S2

CPUfeature
- 1 core up to 1.5 GHz Scorpion
- ARMv7 (From ARMv6 on some model)
- Up to 384K L2
GPUfeatures
- Adreno 205 (From Software rendered or Adreno200)
  - Up to 266 MHz
  - Up to 2 times faster than Adreno 200[11]
  - Up to x2 relative performance on OpenGL ES 2.0 from Adreno 200[12]
  - Up to XGA
  - OpenGL ES 2.0
  - SVGT 1.2[13]
  - OpenVG 1.1
  - Direct Draw
  - GDI
  - Concurrent CPU, DSP, graphics and MDP[13]
Memory features
- Up to LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)
DSPfeatures
- Hexagon QDSP5 at 256 MHz
45 nm manufacturing technology
904 pins[14]

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM7230[8]	45 nm	1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2	Adreno 205 266 MHz (XGA)	Hexagon QDSP5 256 MHz	Up to 12 MP camera	LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)[15]	UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)	Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	Q2 2010
MSM7630[8]	CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055[8]	1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2	—
MSM8255[8]	1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2	UMTS, MBMS; GSM
MSM8655[8]	CDMA2000/UMTS, MBMS; GSM
MSM8255T[8]	1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2	UMTS, MBMS; GSM
MSM8655T[8]	CDMA2000/UMTS, MBMS; GSM

Snapdragon S3 notable features over its predecessor (Snapdragon S2):
Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S3

CPUfeature
- 2 cores up to 1.7 GHz Scorpion
- 512 KB L2
GPUfeatures
- Adreno220
  - Up to 4 time faster than Adreno 200[11]
  - Up to x5 relative performance on OpenGL ES 2.0 from Adreno 200[12]
  - EGL 1.3 (From 1.2)[13]
  - 2x Larger L2 cache (512 KB from 256 KB)
  - Up to WXGA+
DSPfeatures
- Hexagon QDSP6 at 400 MHz (From Hexagon QDSP5 at 256 MHz)
ISPfeatures
- Up to 16 MP camera (From 12 MP)
45 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
APQ8060[8]	45 nm	2 cores up to 1.7 GHz Scorpion: 512 KB L2	Adreno 220 266 MHz (WXGA+)	Hexagon QDSP6 400 MHz	Up to 16 MP camera	LPDDR2 Single-channel 333 MHz (2.67 GB/s)[17]	—	Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0	2011
MSM8260[8]	UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE)	Q3 2010
MSM8660[8]	CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.[18] It was launched in 2012.
The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)
Snapdragon S4 Play
Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Play

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8225[18]	45 nm	2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2	Adreno 203 320 MHz (FWVGA)	Hexagon	Up to 8 MP camera	LPDDR2 Single-channel 300 MHz	UMTS (HSPA); GSM (GPRS, EDGE)	Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0	1H 2012
MSM8625[18]	CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM

Snapdragon S4 Plus
Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Plus
Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):

CPUfeatures
- 2 cores up to 1.7 GHz Krait 200
- 4+4 KB L0, 16+16 KB L1, 1 MB L2
- Out of Order Execution (From Partial Out of Order Execution on Scorpion)
GPUfeatures
- Adreno225
  - Up to 1080p screen
  - Up to 6 time faster than Adreno 200[11]
  - Up to 32 ALU
  - Direct3D feature level 9.0 (From 9.0)[11]
  - Up to x7.5 relative performance on OpenGL ES 2.0 from Adreno 200[12]
- Adreno305
  - Up to 1080p screen (on 400 MHz)
  - Up to 720p screen (on 320 MHz)
  - Up to 24 ALU (From 32 on S3)
  - Unified shader model Scalar instruction set (From Unified shader model 5-way VLIW)
  - Up to x8 relative performance on OpenGL ES 2.0 from Adreno 200[12]
DSPfeatures
- Up to 20 MP or 13.5 MP camera
ISPfeatures
- Hexagon QDSP6
Modem and wirelessfeatures
- Integrated Bluetooth 4.0
- IZat Gen8A (From IZat Gen 7)[19]
28 nm manufacturing technology

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
MSM8227[18]	28 nm	2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 320 MHz (FWVGA / 720p)	Hexagon QDSP6		LPDDR2 Single-channel 400 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0	2H 2012
MSM8627[18]	CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030[18]	2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 305 400 MHz (qHD / 1080p)	Up to 13.5 MP camera	LPDDR2 Single-channel 533 MHz	—	3Q 2012
MSM8230[18]	UMTS; GSM
MSM8630[18]	CDMA/UMTS; GSM
MSM8930[18]	World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A[18]	2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 225 400 MHz (WUXGA / 1080p)	Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	—	2H 2012
MSM8260A[18]	UMTS; GSM	Q1 2012
MSM8660A[18]	CDMA/UMTS; GSM
MSM8960[18][20]	World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)
Further information: Devices using Qualcomm Snapdragon processors § Snapdragon S4 Pro
Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):

CPUfeatures
- up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
- up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
- 4+4 KB L0, 16+16 KB L1, 1 MB L2
GPUfeatures
- Adreno320
  - Support OpenGL ES 3.0
  - Up to 1080p screen
  - Up to 64 ALU (From 32 on S4 plus)
  - Up to x23 relative performance on OpenGL ES 2.0 from Adreno 200[12]
DSPfeatures
- Hexagon QDSP6
ISPfeatures
- Up to 20 MP camera
Modem and wirelessfeatures
- LTE FDD/TDD Cat 3 or external on some models
28 nm LP manufacturing technology
Up to eMMC 4.4/4.4.1

Model number	Fab	CPU (ARMv7)	GPU	DSP	ISP	Memory technology	Modem	Connectivity
MSM8260A Pro[18]	28 nm (TSMC 28LP)	2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2	Adreno 320 400 MHz (WUXGA / 1080p)	Hexagon QDSP6	Up to 20 MP camera	LPDDR2 Dual-channel 500 MHz	UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)	Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T[18]	World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM)	Q2 2012
MSM8960T Pro (MSM8960AB[21])[18]
MSM8960DT[18][22]	2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor	Q3 2013
APQ8064[18][20]	4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (QXGA / 1080p)	LPDDR2 Dual-channel 533 MHz[23]	External	2012

Snapdragon 2 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 2 series
The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 series (2013–2019)

The Snapdragon 200 was announced in 2013.
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.[24]
The Snapdragon 212 was announced on July 28, 2015.[25]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.[26]
The Qualcomm 215 was announced on July 9, 2019.[27] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8225Q[28]	Snapdragon 200	45 nm (TSMC 45LP)	4 cores up to 1.4 GHz Cortex-A5	Adreno 203 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP5	Up to 8 MP single camera	LPDDR2 Single-channel 333 MHz	Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)	Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0	—	2013
MSM8625Q[28]	Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210[28][29]	28 nm (TSMC 28LP)	2 cores up to 1.2 GHz Cortex-A7	Adreno 302 400 MHz (12.8 GFLOPS in FP32)	Hexagon QDSP6	Gobi 3G (UMTS; GSM)
MSM8610[28][29]	Gobi 3G (CDMA/UMTS; GSM)
MSM8212[28][29]	4 cores up to 1.2 GHz Cortex-A7	Gobi 3G (UMTS; GSM)
MSM8612[28][29]	Gobi 3G (CDMA/UMTS; GSM)
MSM8905[30]	Qualcomm 205	2 cores up to 1.1 GHz Cortex-A7	Adreno 304 400 MHz (19.2 GFLOPS in FP32)	Hexagon 536	Up to 3 MP single camera	LPDDR2/3 Single-channel 384 MHz	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.1 + BLE, 802.11n (2.4 GHz)	4.0	2017
MSM8208[31]	Snapdragon 208	Up to 5 MP single camera	LPDDR2/3 Single-channel 400 MHz	Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM)	2.0	2014
MSM8909[32]	Snapdragon 210	4 cores up to 1.1 GHz Cortex-A7	Up to 8 MP single camera	LPDDR2/3 Single-channel 533 MHz	X5 LTE
MSM8909AA[33]	Snapdragon 212	4 cores up to 1.3 GHz Cortex-A7	2015
QM215[34]	Qualcomm 215	4 cores up to 1.3 GHz Cortex-A53	Adreno 308 485 MHz (23.3 GFLOPS in FP32)	Hexagon	Up to 13 MP single camera / 8 MP dual camera	LPDDR3 Single-channel 672 MHz 3 GB	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0	1.0	Q3 2019

Snapdragon 4 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 4 series
The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 series (2013–2021)

The Snapdragon 400 was announced in 2013.
The Snapdragon 410 was announced on December 9, 2013.[35] It was Qualcomm’s first 64-bit mobile system on a chip and first manufactured in China by SMIC.[36]
The Snapdragon 412 was announced on July 28, 2015.[25]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.[37]
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.[38]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.[39]
The Snapdragon 427 was announced on October 18, 2016.[40][41]
The Snapdragon 450 was announced on June 28, 2017.[42] Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.[43] Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.[44]
The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.[45]
The Snapdragon 480+ was announced on October 26, 2021.[46]

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8026[47]	Snapdragon 400	28 nm (TSMC 28LP)	4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)	Hexagon QDSP6	Up to 13.5 MP single camera	LPDDR2/3 Single-channel 533 MHz	—	Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS	1.0	2013
MSM8226[47]	Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626[47]	Gobi 3G (CDMA/UMTS)
MSM8926[47]	Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028[47]	4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)	—
MSM8228[47]	Gobi 3G (UMTS)
MSM8628[47]	Gobi 3G (CDMA/UMTS)
MSM8928[47]	Gobi 4G (LTE Cat 4)
MSM8230[47]	2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2	Adreno 305 400 MHz (19.2 GFLOPS in FP32)	LPDDR2 Single-channel 533 MHz	Gobi 3G (UMTS)
MSM8630[47]	Gobi 3G (CDMA/UMTS)
MSM8930[47]	Gobi 4G (LTE Cat 4)
MSM8930AA[47]	2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2	Gobi 4G (LTE Cat 4)
APQ8030AB[47]	2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2	Adreno 305 450 MHz (21.6 GFLOPS in FP32)	—
MSM8230AB[47]	Gobi 3G (UMTS)
MSM8630AB[47]	Gobi 3G (CDMA/UMTS)
MSM8930AB[47]	Gobi 4G (LTE Cat 4)
APQ8016	Snapdragon 410	28 nm (TSMC 28LP) / 28 nm (SMIC)	4 cores up to 1.2 GHz Cortex-A53	Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32)	Hexagon QDSP6 V5	LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)	—	Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou	2.0	H1 2014
MSM8916[48]	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2[49]	Snapdragon 412	28 nm (TSMC 28LP)	4 cores up to 1.4 GHz Cortex-A53	Adreno 306 450 MHz (21.6 GFLOPS in FP32)	LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s)	H2 2015
MSM8929[50]	Snapdragon 415	4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53)	Adreno 405 465 MHz (44.6 GFLOPS in FP32)	Hexagon V50	Up to 13 MP single camera	LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s)	Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS	H1 2015
MSM8917[51]	Snapdragon 425	4 cores up to 1.4 GHz Cortex-A53	Adreno 308 598 MHz (28.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera	X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C	Q3 2016
MSM8920[52]	Snapdragon 427	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	3.0	Q1 2017
MSM8937[53]	Snapdragon 430	4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53)	Adreno 505 450 MHz (43.2 GFLOPS in FP32)	Up to 21 MP single camera	LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X6 LTE	Q2 2016
MSM8940[54]	Snapdragon 435	X9 LTE	Q4 2016
SDM429[55]	Snapdragon 429	12 nm (TSMC 12FFC)	4 cores up to 2.0 GHz Cortex-A53	Adreno 504 320 MHz (30.7 GFLOPS in FP32)	Hexagon 536	Up to 16 MP single camera / 8 MP dual camera	X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s)	Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0	Q3 2018
SDM439[56]	Snapdragon 439	4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)	Adreno 505 650 MHz (62.4 GFLOPS in FP32)	Up to 21 MP single camera / 8 MP dual camera
SDM450[57]	Snapdragon 450	14 nm (Samsung 14LPP)	8 cores up to 1.8 GHz Cortex-A53	Adreno 505 600 MHz (57.6 GFLOPS in FP32)	Hexagon 546	Up to 24 MP single camera / 13 MP dual camera	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0	Q3 2017
SM4250-AA[58]	Snapdragon 460	11 nm (Samsung 11LPP)	4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53)	Adreno 610 600 MHz (153.6 GFLOPS in FP32)	Hexagon 683	Spectra 340 (48 MP single camera / 16 MP dual camera)	LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C	Q1 2020
SM4350[59]	Snapdragon 480	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55)	Adreno 619 650 MHz (332.8 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO), USB C	4+	H1 2021
SM4350-AC[60]	Snapdragon 480+	2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55)	FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2×2 (MU-MIMO), USB C	Q4 2021

Snapdragon 4 (2022-2024)

The Snapdragon 4 Gen 1 was announced on September 6, 2022.[61]
The Snapdragon 4 Gen 2 was announced on June 26, 2023.[62]
The Snapdragon 4 Gen 2 Leading Version was launched on Redmi Note 13R on May 17, 2024.[63]
The Snapdragon 4s Gen 2 was announced on July 30, 2024.[64]

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM4375[65]	Snapdragon 4 Gen 1	6 nm (TSMC N6)	2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 619 700 MHz (358.4 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2×2 (MU-MIMO), USB 3.1	4+	Q3 2022
SM4450[66]	Snapdragon 4 Gen 2	4 nm (Samsung 4LPX)	2 + 6 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)	Adreno 613 955 MHz (244.5 GFLOPS in FP32)	—	Spectra (108 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)	Bluetooth 5.1, 802.11a/b/g/n/ac 1×1, USB 3.2 Gen 1	Q2 2023
Snapdragon 4 Gen 2 Accelerated Edition[a]	4 nm (TSMC N4)	2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)	Q2 2024
SM4635[67]	Snapdragon 4s Gen 2	4 nm (Samsung)	2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 611	Spectra (84 MP single camera / 16 MP dual camera with ZSL)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)	Internal (5G NR Sub-6: download up to 1 Gbit/s)	Q3 2024

Snapdragon 6 Series

Further information: Devices using Qualcomm Snapdragon processors § Snapdragon 6 series
The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 series (2013–2023)

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro	Snapdragon 600	28 nm (TSMC 28LP)	4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 400 MHz (76.8 GFLOPS in FP32)	Hexagon QDSP6 V4 500 MHz	Up to 21 MP single camera; Video Capture: 1080p@30fps	DDR3L-1600 (12.8 GB/sec)	External	Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A	1.0	Q1 2013
APQ8064M[83]	4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)
APQ8064T[83]	LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)
APQ8064AB[83]	4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2	Adreno 320 450 MHz (86.4 GFLOPS in FP32)
MSM8936[84]	Snapdragon 610	4 cores 1.7 GHz Cortex-A53	Adreno 405 550 MHz (52.8 GFLOPS in FP32)	Hexagon V50 700 MHz	LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)	X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)	Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou	2.0	Q3 2014
MSM8939[85]	Snapdragon 615	4 + 4 cores (1.7 GHz + 1.1 GHz Cortex-A53)
MSM8939 v2[86]	Snapdragon 616	4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53)	Q3 2015
MSM8952[87]	Snapdragon 617	4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53)	Hexagon 546	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0	3.0	Q4 2015
MSM8953[88]	Snapdragon 625	14 nm (Samsung 14LPP)	8 cores up to 2.0 GHz Cortex-A53	Adreno 506 650 MHz (62.4 GFLOPS in FP32)	Up to 24 MP single camera; Video Capture: 4K@30fps	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0	Q2 2016
MSM8953 Pro[89]	Snapdragon 626	8 cores up to 2.2 GHz Cortex-A53	Q4 2016
SDM630[90]	Snapdragon 630	4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)[91][92]	Adreno 508 650 MHz (124.8 GFLOPS in FP32)	Hexagon 642	Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1	4.0	Q2 2017
SDM632[93]	Snapdragon 632	4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53)[94]	Adreno 506 725 MHz (69.6 GFLOPS in FP32)	Hexagon 546	Up to 40 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps	LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	3.0	Q3 2018
SDM636[95]	Snapdragon 636	4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53)	Adreno 509 430 MHz (110.1 GFLOPS in FP32)	Hexagon 680	Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	4.0	Q4 2017
MSM8956[96]	Snapdragon 650	28 nm (TSMC 28HPM)	2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)	Adreno 510 600 MHz (153.6 GFLOPS in FP32)	Hexagon V56	Up to 21 MP single camera; Video Capture: 4K@30fps	LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s)	X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s)	Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0	3.0	Q1 2016
MSM8976[97]	Snapdragon 652	4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976 Pro[98]	Snapdragon 653	4 + 4 cores (1.95 GHz Cortex-A72 + 1.40 GHz Cortex-A53)	Adreno 510 621 MHz (159 GFLOPS in FP32)	X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Q4 2016
SDM660[99]	Snapdragon 660	14 nm (Samsung 14LPP)	4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53)	Adreno 512 647 MHz (165.6 GFLOPS in FP32)	Hexagon 680	Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4.0	Q2 2017
SDA660[100]	Internal: no
SM6115[101]	Snapdragon 662	11 nm (Samsung 11LPP)	4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53)	Adreno 610 950 MHz (243.2 GFLOPS in FP32)	Hexagon 683	Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps)	LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C	3.0	Q1 2020
SM6125[102]	Snapdragon 665	Hexagon 686 (3.3 TOPS)	Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps)	X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1	Q2 2019
SDM670[103]	Snapdragon 670	10 nm (Samsung 10LPP)	2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)[104]	Adreno 615 430 MHz (220.2 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)	Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1	4+	Q3 2018
SM6150[105]	Snapdragon 675	11 nm (Samsung 11LPP)	2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)[106]	Adreno 612 845 MHz (216.3 GFLOPS in FP32)	Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	Q1 2019
SM6150-AC[107]	Snapdragon 678	2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)	Adreno 612 895 MHz (229.1 GFLOPS in FP32)	Q4 2020
SM6225[108]	Snapdragon 680	6 nm (TSMC N6)	4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1114 MHz (285.2 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, NavIC, USB C	3.0	Q4 2021
SM6225-AD[109]	Snapdragon 685	4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53)	Adreno 610 1260 MHz (322.6 GFLOPS in FP32)	Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 1×1, USB 3.1	Q1 2023
SM6350[110]	Snapdragon 690	8 nm (Samsung 8LPP)	2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55)	Adreno 619L 565 MHz (289.3 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO), USB 3.1	4+	H2 2020
SM6375[111]	Snapdragon 695	6 nm (TSMC N6)	2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55)	Adreno 619 840 MHz (430.1 GFLOPS in FP32)	Hexagon 686 (3.3 TOPS)	Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2×2 (MU-MIMO), USB C	Q4 2021

Snapdragon 6 (2022–2024)

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM6450[113]	Snapdragon 6 Gen 1	4 nm (Samsung 4LPX)	4 + 4 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 710 676 MHz (346.1 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q1 2023
SM6115-AC[114]	Snapdragon 6s Gen 1	11 nm (Samsung 11LPP)	4 + 4 cores (2.1 GHz Kryo Gold – Cortex-A73 + 2.0 GHz Kryo Silver – Cortex-A53)	Adreno 610 1050 MHz (268.8 GFLOPS in FP32)	Hexagon	Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps)	LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s)	FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C	3.0	Q3 2024
SM6475-AB[115]	Snapdragon 6 Gen 3	4 nm (Samsung 4LPX)	4 + 4 cores (2.4 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55)	Adreno 710	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q3 2024
SM6375-AC[116]	Snapdragon 6s Gen 3	6 nm (TSMC N6)	2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 2.0 GHz Kryo Silver – Cortex-A55)	Adreno 619 900 MHz (460.8 GFLOPS in FP32)	Hexagon	Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s)	FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2×2 (MU-MIMO), USB C	Q2 2024

Snapdragon 7 Series

Snapdragon 700 series (2018–2022)

Model number	Product Name	Fab	CPU (ARMv8.2)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SDM710[129]	Snapdragon 710	10 nm (Samsung 10LPP)	2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 504 MHz (258 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; NFC; 802.11a/b/g/n/ac 2×2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	4	Q2 2018
SDM712[130]	Snapdragon 712	2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)	Adreno 616 610 MHz (312.3 GFLOPS in FP32)	4+	Q1 2019
SM7125[131]	Snapdragon 720G	8 nm (Samsung 8LPP)	2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55)	Adreno 618 750 MHz (384 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps)	FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1	Q1 2020
SM7150-AA,[132]	Snapdragon 730	2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 610 MHz (312.3 GFLOPS in FP32)	Hexagon 688 (3.6 TOPs)	Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q2 2019
SM7150-AB[133]	Snapdragon 730G	Adreno 618 700 MHz (358.4 GFLOPS in FP32)
SM7150-AC[134]	Snapdragon 732G	2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55)	Adreno 618 800 MHz (409.6 GFLOPS in FP32)	FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q3 2020
SM7225[135]	Snapdragon 750G	2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55)	Adreno 619 800 MHz (409.6 GFLOPS in FP32)	Hexagon 694 (4.7 TOPs)	Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)	Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2×2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q4 2020
SM7250-AA,[136]	Snapdragon 765	7 nm (Samsung 7LPP)	1x 2.3 GHz {765} Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 540 MHz (414.7 GFLOPS in FP32)	Hexagon 696 (5.4 TOPs)	Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR)	FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax 2×2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q1 2020
SM7250-AB[137]	Snapdragon 765G	1x 2.4 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 625 MHz (480 GFLOPS in FP32)
SM7250-AC[138]	Snapdragon 768G	1x 2.8 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55)	Adreno 620 750 MHz (576 GFLOPS in FP32)	FastConnect 6200; Bluetooth 5.2; NFC; 802.11a/b/g/n/ac/ax 2×2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q2 2020
SM7325[139]	Snapdragon 778G	6 nm (TSMC N6)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 550 MHz (563.2 GFLOPS in FP32)	Hexagon 770 (12 TOPs)	Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	Q2 2021
SM7325-AE[140]	Snapdragon 778G+	1x 2.5 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 608 MHz (622.6 GFLOPS in FP32)	Q4 2021
SM7350-AB[141]	Snapdragon 780G	5 nm (Samsung 5LPE)	1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642 490 MHz (752.6 GFLOPS in FP32)	Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)	Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	Q1 2021
SM7325-AF[142]	Snapdragon 782G	6 nm (TSMC N6)	1x 2.7 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55)	Adreno 642L 719 MHz (736.3 GFLOPS in FP32)	Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	Q4 2022

Snapdragon 7 (2022–2024)

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SM7450-AB[148]	Snapdragon 7 Gen 1	4 nm (Samsung 4LPX)	1x 2.4 GHz {2.5 GHz Accelerated Edition} Kryo Prime (Cortex-A710) + 3x 2.36 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 644 443 MHz (680.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q2 2022
SM7475-AB[149]	Snapdragon 7+ Gen 2	4 nm (TSMC N4)	1x 2.91 GHz Kryo Prime (Cortex-X2) + 3x 2.49 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 725 580 MHz (1187.8 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q1 2023
SM7435-AB[150]	Snapdragon 7s Gen 2	4 nm (Samsung 4LPX)	4 + 4 cores (2.4 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55)	Adreno 710 940 MHz (481.3 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q3 2023
SM7550-AB[151]	Snapdragon 7 Gen 3	4 nm (TSMC N4P)	1x 2.63 GHz Kryo Prime (Cortex-A715) + 3x 2.4 GHz Kryo Gold (Cortex-A715) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 720 975 MHz (998.4 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2023
SM7675-AB[152]	Snapdragon 7+ Gen 3	1× 2.8 GHz Kryo Prime (Cortex-X4) + 4× 2.6 GHz Kryo Gold (Cortex-A720) + 3× 1.9 GHz Kryo Silver (Cortex-A520)	Adreno 732 950 MHz (1459.2 GFLOPS in FP32)	Hexagon	Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR)	LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2×2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	Q1 2024
SM7635[153]	Snapdragon 7s Gen 3	1× 2.5 GHz Kryo Prime (Cortex-A720) + 3× 2.4 GHz Kryo Gold (Cortex-A720) + 4× 1.8 GHz Kryo Silver (Cortex-A520)	Adreno	Hexagon	Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR)	LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s)	FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	4+	Q3 2024

Snapdragon 8 Series

Snapdragon 800 series (2013–2021)

Model number	Product Name	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
APQ8074AA[227]	Snapdragon 800	28 nm (TSMC 28HPM)	4 cores up to 2.26 GHz Krait 400	Adreno 330 450 MHz (115.2 GFLOPS in FP32)	Hexagon QDSP6 V5 600 MHz	Up to 21 MP single camera	LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)	—	Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B	2.0	Q2 2013[68]
MSM8274AA[227]	Gobi 3G (UMTS)
MSM8674AA[227]	Gobi 3G (CDMA/UMTS)
MSM8974AA[227]	Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3[157]	Snapdragon 801	Gobi 4G (LTE Cat 4)	Q3 2014
APQ8074AB v3[157]	4 cores up to 2.36 GHz Krait 400	Adreno 330 578 MHz[228] (150 GFLOPS in FP32)	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	—	Q4 2013
MSM8274AB[227]	Snapdragon 800	Gobi 3G (UMTS)	Q4 2013[229]
MSM8674AB v3[157]	Snapdragon 801	Gobi 3G (CDMA/UMTS)	Q2 2013[68]
MSM8974AB v3[157]	Gobi 4G (LTE Cat 4)	Q4 2013
MSM8274AC v3[157]	4 cores up to 2.45 GHz[230] Krait 400[231]	Gobi 3G (UMTS)	Q2 2014[68]
MSM8974AC v3[157]	Gobi 4G (LTE Cat 4)	Q1 2014[68]
APQ8084[232]	Snapdragon 805	4 cores up to 2.7 GHz Krait 450	Adreno 420 600 MHz (153.6 GFLOPS in FP32)	Hexagon V50 800 MHz	Up to 55 MP single camera	LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)	External	Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B	Q1 2014
MSM8992[165][233]	Snapdragon 808	20 nm (TSMC)	2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)[234]	Adreno 418 600 MHz[235] (153.6 GFLOPS in FP32)	Hexagon V56 800 MHz	Up to 21 MP single camera	LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)	X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)[236]	Bluetooth 4.1; 802.11ac; IZat Gen8C	Q3 2014[237]
MSM8994[169][233]	Snapdragon 810	4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)[238]	Adreno 430 600 MHz (230.4 GFLOPS in FP32)	Up to 55 MP single camera	LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994v2[239]	Adreno 430 630 MHz[239] (241.9 GFLOPS in FP32)	2015[239]
MSM8994v2.1[240]	Q2 2015
MSM8996 Lite[241]	Snapdragon 820	14 nm FinFET (Samsung 14LPP)	2 + 2 cores Kryo (1.804 GHz + 1.363 GHz)	Adreno 530 510 MHz (261.1 GFLOPS in FP32)	Hexagon 680 1 GHz	Spectra	LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)	X12 LTE (download: Cat 12, up to 600 Mbit/s; 3×20 MHz CA; 64-QAM; 4×4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2×20 MHz CA; 64-QAM.)	Bluetooth 4.1; 802.11ac/ad; IZat Gen8C	3.0	Q1 2016
MSM8996[241]	2 + 2 cores Kryo (2.15 GHz + 1.593 GHz)	Adreno 530 624 MHz (319.5 GFLOPS in FP32)	LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)	Q4 2015
MSM8996 Pro-AB[242][243]	Snapdragon 821	Q3 2016
MSM8996 Pro-AC[242][243][244]	2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz)	Adreno 530 653 MHz (334.3 GFLOPS in FP32)
MSM8998[245]	Snapdragon 835	10 nm FinFET (Samsung 10LPE)	4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53)	Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4×20 MHz CA; 256-QAM; 4×4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4.0	Q2 2017[246]
SDM845[187]	Snapdragon 845	10 nm FinFET (Samsung 10LPP)	4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPs)	Spectra 280	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5×20 MHz CA; 256-QAM; 4×4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2×20 MHz CA; 64-QAM)	4+	Q1 2018
SM8150[247]	Snapdragon 855	7 nm (TSMC N7)	1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 640 585 MHz (898.6 GFLOPS in FP32)	Hexagon 690 (7 TOPs)	Spectra 380	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7×20 MHz CA, 256-QAM, 4×4 MIMO on 5C. Upload up to 316 Mbit/s, 3×20 MHz CA, 256-QAM) + External: X50 5G[248] (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q1 2019
SM8150-AC[249]	Snapdragon 855+	1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 640 675 MHz (1036.8 GFLOPS in FP32)	Q3 2019
Snapdragon 860	Q1 2021
SM8150P	Snapdragon 855+	Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	Q3 2019
SM8250[250]	Snapdragon 865	7 nm (TSMC N7P)	1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 587 MHz (901.6 GFLOPS in FP32)	Hexagon 698 (15 TOPs)	Spectra 480	LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)	Internal: no + External : X55 5G[251] (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q1 2020
SM8250-AB[252]	Snapdragon 865+	1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	Adreno 650 670 MHz (1029.1 GFLOPS in FP32)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q3 2020
SM8250-AC[253]	Snapdragon 870	1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)	FastConnect 6800; Bluetooth 5.2;[254] 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1	Q1 2021
SM8350[255]	Snapdragon 888	5 nm (Samsung 5LPE)	1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)	Adreno 660 840 MHz (1290.2 GFLOPS in FP32)	Hexagon 780 (26 TOPs)	Spectra 580	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q1 2021
SM8350-AC[256]	Snapdragon 888+	1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)	Hexagon 780 (32 TOPs)	Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8450[258]	Snapdragon 8 Gen 1	4 nm (Samsung 4LPX)	1x 3.0 GHz Kryo Prime (Cortex-X2) + 3x 2.5 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510)	Adreno 730 818 MHz (1675.3 GFLOPs in FP32)	Hexagon 52 TOPS, some cases up to 104 TOPS	Spectra	LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)	Internal: X65 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)	FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2021[263]
SM8475[264]	Snapdragon 8+ Gen 1	4 nm (TSMC N4)	Adreno 730 900 MHz (1843.2 GFLOPS in FP32)	Q2 2022[265]
1x 3.2 GHz Kryo Prime (Cortex-X2) + 3x 2.75 GHz Kryo Gold (Cortex-A710) + 4x 2.0 GHz Kryo Silver (Cortex-A510)

Snapdragon 8 Gen 2 (2023)

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8550-AB[270]	Snapdragon 8 Gen 2	4 nm (TSMC N4)	1× 3.2 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno 740 680 MHz (2089 GFLOPS in FP32)	Hexagon	Spectra	LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[271] or FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[272][273]	5	Q4 2022[266]
SM8550-AC	Snapdragon 8 Gen 2 for Galaxy		1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510)	Adreno 740 719 MHz (2208.8 GFLOPS in FP32)							Q1 2023

Snapdragon 8/8s Gen 3 (2024)

Model number	Product Name	Fab	CPU (ARMv9)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Released
SM8650-AB[276]	Snapdragon 8 Gen 3	4 nm (TSMC N4P)	1× 3.30 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno 750 903 MHz (2774 GFLOPS in FP32)	Hexagon	Spectra	LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)	Internal: X75 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)	FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1	5	Q4 2023[274]
SM8650-AC	Snapdragon 8 Gen 3 for Galaxy	1× 3.40 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520)	Adreno 750 1000 MHz (3072 GFLOPS in FP32)	Q1 2024
SM8635[277]	Snapdragon 8s Gen 3	1× 3.0 GHz Kryo Prime (Cortex-X4) + 4× 2.8 GHz Kryo Gold (Cortex-A720) + 3× 2.0 GHz Kryo Silver (Cortex-A520)	Adreno 735 1100 MHz (1689.6 GFLOPS in FP32)	LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)	Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 6.5 Gbit/s, upload up to 3.5 Gbit/s)	Q1 2024[278]

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
MSM8998[280]	Snapdragon 835 Mobile PC Platform	10 nm (Samsung 10LPE)	Kryo 280 4 + 4 cores (2.6 GHz + 1.9 GHz)	Adreno 540 710 MHz (363.5 GFLOPS in FP32)	Hexagon 682	Spectra 180 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)	X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4×20 MHz CA; 256-QAM; 4×4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS	4	Q2 2018
SDM850[281]	Snapdragon 850 Mobile Compute Platform	10 nm (Samsung 10LPP)	Kryo 385 4 + 4 cores (2.96 GHz + 1.77 GHz)	Adreno 630 710 MHz (727 GFLOPS in FP32)	Hexagon 685 (3 TOPS)	Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)	X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5×20 MHz CA; 256-QAM; 4×4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2×20 MHz CA; 64-QAM)	4+	Q3 2018

Snapdragon 7c/7c+ Compute Platforms

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC7180[285]	Snapdragon 7c	8 nm (Samsung 8LPP)	Kryo 468 2 + 6 cores (up to 2.4 GHz)	Adreno 618 825 MHz (422.4 GFLOPS in FP32)	Hexagon 692 (5 TOPS)	Spectra 255 (Up to 32 MP camera / 16 MP dual)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)	X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad/ax (Wi-Fi 6); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0		Q1 2020
SC7180P[286]	Snapdragon 7c Gen 2	Kryo 468 2 + 6 cores (up to 2.55 GHz)	Q2 2021
SC7280[287]	Snapdragon 7c+ Gen 3	6 nm (TSMC N6)	Kryo 4 Gold + 4 Silver cores (Cortex-A78r1p1, up to 2.4 GHz) + Cortex-A55 r2p0	Hexagon (6.5 TOPS)	Spectra (64 MP single camera / 36+22 MP dual camera)	LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)	Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)	FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD		Q1 2022

Snapdragon 8c Compute Platforms

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180[288]	Snapdragon 8c	7 nm (TSMC N7)	Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz)	Adreno 675 590 MHz	Hexagon 690 (9 TOPS)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)	Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7×20 MHz CA, 256-QAM, 4×4 MIMO on 5C. Upload up to 316 Mbit/s, 3×20 MHz CA, 256-QAM) + External: X55 5G/LTE[251] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q1 2020

Snapdragon 8cx Compute Platforms

Model number	Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
SC8180X[297]	Snapdragon 8cx	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 680 585 MHz (1797.1 GFLOPS in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (32 MP single camera / 16 MP at 30fps dual camera with MFNR/ZSL)[298]	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7×20 MHz CA, 256-QAM, 4×4 MIMO on 5C. Upload up to 316 Mbit/s, 3×20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q3 2019
SC8180XP[299]	Snapdragon 8cx Gen 2 5G	Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55)	Adreno 690 660 MHz (2027.5 GFLOPS in FP32)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7×20 MHz CA, 256-QAM, 4×4 MIMO on 5C. Upload up to 316 Mbit/s, 3×20 MHz CA, 256-QAM) or X55 5G/LTE[251] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2×2 (MU-MIMO) up to 2.4 Gbit/s, NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD	Q3 2020
SC8280[300]	Snapdragon 8cx Gen 3	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)[294]	Adreno 695 900 MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)[301]	Spectra (24 MP at 30fps single camera with MFNR/ZSL)	No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q1 2022

Microsoft SQ Compute Platforms

Product Name	Fab	CPU (ARMv8)	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Quick Charge	Sampling availability
Microsoft SQ1	7 nm (TSMC N7)	Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)	Adreno 685 590MHz (1812.5 GFLOPs in FP32)	Hexagon 690 (9 TOPS)	Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL)	LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)	No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7×20 MHz CA, 256-QAM, 4×4 MIMO on 5C. Upload up to 316 Mbit/s, 3×20 MHz CA, 256-QAM)	Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD	4+	Q4 2019
Microsoft SQ2	Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)	Adreno 690 680MHz (2089 GFLOPs in FP32)	Q4 2020
Microsoft SQ3[305][306]	5 nm (Samsung 5LPE)	Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)	Adreno 695 900MHz (3686.4 GFLOPS in FP32)	Hexagon (15 TOPS)[307]	Spectra (24 MP at 30fps single camera with MFNR/ZSL)	No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD		Q3 2022

Snapdragon X series

Snapdragon X Elite[312][311]
Snapdragon X Plus[310][311]
Model number	Fab	CPU	GPU	DSP	ISP	Memory technology	Modem	Connectivity	Sampling availability
X1P-42-100	4 nm (TSMC N4)	Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz)	Adreno X1-45 1107 MHz (1.7 TFLOPS)	Hexagon (45 TOPS)	Spectra (36 MP single camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD	Mid-2024
X1P-46-100	Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz)	Adreno X1-45 (2.1 TFLOPS)
X1P-64-100	Oryon 10 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)	Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100	Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
X1E-78-100	4 nm (TSMC N4)	Oryon 12 core (3.4 GHz)	Adreno X1-85 1250 MHz (3.8 TFLOPS)	Hexagon (45 TOPS)	Spectra (64 MP single camera / 36 MP dual camera)	LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)	No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)	No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2×2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD	Mid-2024
X1E-80-100	Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100	Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz)	Adreno X1-85 1500 MHz (4.6 TFLOPS)
X1E-00-1DE	Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

FRT Tool · Sunday at 10:09 PM

UNISOC systems on chips

4G smartphone processors

Model Number	Fab	CPU	GPU	Memory technology	Wireless radio technologies	Released	Utilizing devices
ISA	μarch	Cores	Freq. (GHz)
SC9830A	28 nm HPm	ARMv7-A	ARM Cortex-A7	4	1.5	Mali-400 MP2 @ 512 MHz	Single/dual-channel LPDDR1/2/3	GSM Multi-Mode, WCDMA/TD-SCDMA/LTE, Bluetooth 4.0, WiFi 802.11b/g/n, GPS, FM	?	show List
SC9830	1.2	Mali-400 MP2	Q4 2015	show List
SC9832A	1.3	Mali-400 MP2 @ 512 MHz	2016	show List
SC9850	Mali-T820 MP1	Single/dual-channel LPDDR3/4	2018	show List
SC9850K[29]	2018	show List
SC9832E[30]	ARMv8-A	ARM Cortex-A53	1.4	Mali-T820 MP1 @680 MHz	LPDDR2 @ 533 MHz, LPDDR3 @ 666 MHz	2018	show List
SC9860	16 nm FFC	8	2.0	Mali-T880 MP4		?
SC9860GV	4 + 4	2.0 + 1.25		TD-LTE / FDD LTE / TD-SCDMA / WCDMA / EGG LTE Category 7 (DL:300 Mbit/s., UL:100 Mbit/s)	?
SC9863[31]	28 nm HPC+	ARM Cortex-A55	8	1.6 + 1.2	PowerVR GE 8322 @550 MHz		LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG)	Q1 2019	show List
SC9863A[32]	LPDDR3/4/4X @ 933 MHz	Q4 2019	show List
SC9853I	14 nm FF	x86-64	Intel Airmont	8	1.8	Mali-T820 MP2		LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG)	Q2 2017	show List
SC9861G-IA[33]	8	2.0	PowerVR GT7200		LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG)	Q2 2017
Tiger T310	12 nm FF TSMC	ARMv8.2-A	ARM Cortex-A75	1	2.0	PowerVR GE8300 @800 MHz	LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1333 MHz	(TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / CDMA / GSM)	Q2 2019	show List
ARM Cortex-A55	3	1.8
Tiger T603	28 nm		8	1.8	–	LPDDR4, LPDDR4X	(TDD-LTE / FDD-LTE / WCDMA / CDMA / GSM)	–
Tiger T606	12 nm FF TSMC	ARM Cortex-A75	2	1.6	Mali-G57 MC1 @650 MHz	LPDDR4X @ 1600 MHz	(TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / CDMA / GSM)	Q3 2021	show List
ARM Cortex-A55	6
Tiger T610	ARM Cortex-A75	2	1.8	Mali-G52 MC2 @614.4 MHz	LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1600 MHz	Q4 2019	show List
ARM Cortex-A55	6
Tiger T612	ARM Cortex-A75	2	Mali-G57 MC1	LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1866 MHz	Q1 2022	show List
ARM Cortex-A55	6
Tiger T615[34]	ARM Cortex-A75	2	1.8	Mali-G57 MC1 @850 MHz	LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1866 MHz	Q3 2024
ARM Cortex-A55	6	1.6
Tiger T616	ARM Cortex-A75	2	2.0	Mali-G57 MC1 @750 MHz	LPDDR4X @ 1866 MHz	Q3 2021	show List
ARM Cortex-A55	6	1.8
Tiger T618	ARM Cortex-A75	2	2.0	Mali-G52 MC2 @850 MHz	Dual-channel LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1866 MHz	Q3 2019	show List
ARM Cortex-A55	6
Tiger T619[35]	ARM Cortex-A75	2	2.2	Mali-G57 MC1 @850 MHz	LPDDR4X @ 1866 MHz	Q3 2023	show List
ARM Cortex-A55	6	1.8
Tiger T620[37]	ARM Cortex-A75	2	2.2	Mali-G57 MC1 @850 MHz	LPDDR4X @ 1866 MHz	Q3 2024
ARM Cortex-A55	6	1.8
Tiger T700	ARM Cortex-A75	2	1.8	Mali-G52 MP2 @850 MHz		Q1 2021	show List
ARM Cortex-A55	6
Tiger T710	ARM Cortex-A75	4	PowerVR GM 9446 @800 MHz	LPDDR4/4X/4Y @ 1866 MHz	Q3 2019
ARM Cortex-A55	4

5G smartphone processors

Model number	Fab	CPU (ARMv8)	GPU	Memory technology	Wireless radio technologies	Released
Tanggula T740 (Tiger T7510)	12 nm FF TSMC	4 + 4 cores 1.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55	PowerVR GM 9446 @800 MHz	LPDDR4/4X/4Y up to 1866 MHz	Wi-Fi 802.11b/g/n/ac, Bluetooth 5.0, FM, GPS, NSA, SA, GSM, WCDMA, LTE, TDD-LTE, FDD-LTE, Glonass, Beidou, Galileo	Q1 2020
Tanggula T750	6 nm EUV TSMC	2 + 6 cores 2.0 GHz Cortex-A76 + 1.8 GHz Cortex-A55	Mali-G57 MP2 @680MHz	LPDDR4X, eMMC5.1, UFS3.1	Q2 2023
Tanggula T760	4 + 4 cores 2.2 GHz Cortex-A76 + 2.0 GHz Cortex-A55	Mali-G57 MP4 @650 MHz	Dual-channel LPDDR4/4X up to 2133 MHz	Q2 2021
Tanggula T765	2 + 6 cores 2.3 GHz Cortex-A76 + 2.1 GHz Cortex-A55	Mali-G57 MC2 @850 MHz	Q1 2024
Tanggula T770 (Tiger T7520)	1 + 3 + 4 cores 2.5 GHz Cortex-A76 + 2.2 GHz Cortex-A76 + 2.0 GHz Cortex-A55	Mali-G57 MP4 @780 MHz	Q1 2020
Tanggula T820	1 + 3 + 4 cores 2.7 GHz Cortex-A76 + 2.3 GHz Cortex-A76 + 2.1 GHz Cortex-A55	Q4 2022	ZTE Nubia Neo 5G

HOT FRT Tool Supported Chipset: Helio Series, Dimensity Series, Qualcomm Snapdragon Series, UNISOC Series ·············

FRT Tool

Smartphone processors from ARMv5 to ARMv8 (2003–2019)​

ARMv5​

ARMv6​

ARMv7 - Single Core​

ARMv7 - Dual-core​

ARMv7 - Quad-core​

ARMv7 - Hexa-core and octa-core​

ARMv8 - Quad Core​

ARMv8 - Octa Core​

FRT Tool

Helio Series​

Helio X Series (2014–2017)​

Helio A Series (2018–2020)​

Helio P Series (2015–2020)​

Helio G Series (2019–present)​

FRT Tool

Dimensity Series (2020–present)​

Dimensity 700 Series​

Dimensity 800 Series​

Dimensity 900 Series​

Dimensity 1000 Series​

Dimensity 6000 Series​

Dimensity 7000 Series​

Dimensity 8000 Series​

Dimensity 9000 Series​

FRT Tool

Qualcomm Snapdragon systems on chips​

Before Snapdragon​

Snapdragon S series​

Snapdragon 2 Series​

Snapdragon 200 series (2013–2019)​

Snapdragon 4 Series​

Snapdragon 400 series (2013–2021)​

Snapdragon 4 (2022-2024)​

Snapdragon 6 Series​

Snapdragon 600 series (2013–2023)​

Snapdragon 6 (2022–2024)​

Snapdragon 7 Series​

Snapdragon 700 series (2018–2022)​

Snapdragon 7 (2022–2024)​

Snapdragon 8 Series​

Snapdragon 800 series (2013–2021)​

Snapdragon 8/8+ Gen 1 (2022)​

Snapdragon 8 Gen 2 (2023)​

Snapdragon 8/8s Gen 3 (2024)​

Mobile Compute Platforms​

Snapdragon 835 and Snapdragon 850​

Snapdragon 7c/7c+ Compute Platforms​

Snapdragon 8c Compute Platforms​

Snapdragon 8cx Compute Platforms​

Microsoft SQ Compute Platforms​

Snapdragon X series​

FRT Tool

UNISOC systems on chips​

4G smartphone processors​

5G smartphone processors​

Smartphone processors from ARMv5 to ARMv8 (2003–2019)

ARMv5

ARMv6

ARMv7 - Single Core

ARMv7 - Dual-core

ARMv7 - Quad-core

ARMv7 - Hexa-core and octa-core

ARMv8 - Quad Core

ARMv8 - Octa Core

Helio Series

Helio X Series (2014–2017)

Helio A Series (2018–2020)

Helio P Series (2015–2020)

Helio G Series (2019–present)

Dimensity Series (2020–present)

Dimensity 700 Series

Dimensity 800 Series

Dimensity 900 Series

Dimensity 1000 Series

Dimensity 6000 Series

Dimensity 7000 Series

Dimensity 8000 Series

Dimensity 9000 Series

Qualcomm Snapdragon systems on chips

Before Snapdragon

Snapdragon S series

Snapdragon 2 Series

Snapdragon 200 series (2013–2019)

Snapdragon 4 Series

Snapdragon 400 series (2013–2021)

Snapdragon 4 (2022-2024)

Snapdragon 6 Series

Snapdragon 600 series (2013–2023)

Snapdragon 6 (2022–2024)

Snapdragon 7 Series

Snapdragon 700 series (2018–2022)

Snapdragon 7 (2022–2024)

Snapdragon 8 Series

Snapdragon 800 series (2013–2021)

Snapdragon 8/8+ Gen 1 (2022)

Snapdragon 8 Gen 2 (2023)

Snapdragon 8/8s Gen 3 (2024)

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

Snapdragon 7c/7c+ Compute Platforms

Snapdragon 8c Compute Platforms

Snapdragon 8cx Compute Platforms

Microsoft SQ Compute Platforms

Snapdragon X series

UNISOC systems on chips

4G smartphone processors

5G smartphone processors