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Device lifetime: Urgent (Consumed 90% of the reserved block) vivo v1.....?

wasim007

wasim007

Active Member
Jan 4, 2019
42
14
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5885
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0xAFC11CFF
Manufacturing date: May 2015
CID: 90014A48 41473265 0507AFC1 1CFF528A
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
Cache size: 1 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: vivo
board: msm8916, name: V1
brand: vivo, model: vivo V1
build id: LRX22G, version: 5.0.2 Lollipop (LRX22G release-keys)
build description: msm8916_64-user 5.0.2 LRX22G eng.compiler.20160616.121659 release-keys

Internal storage: 10.89 GiB
crypto state: unencrypted
eMMC 5.x HEALTH report:
Device lifetime: Urgent (Consumed 90% of the reserved block)
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): 60% - 70% device life time used
Selected: [HYNIX] eNAND H9TQ17ABJTMCUR-KUM/16GB+LPDDR3 16Gb (BGA221)

how to repair this emmc ic
 
H

harendra8873737345

Member
Oct 15, 2019
8
1
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-3153
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HCG8a4 (0x484347386134), rev: 0xA2, serial number: 0x4A761040
Manufacturing date: Dec 2018
CID: 90014A48 43473861 34A24A76 1040C554
CSD: D0270132 8F5903FF FFFFFFEF 8A400026
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID System Info:
platform: msm8937, cpu abi: arm64-v8a
manufacturer: vivo
board: QC_Reference_Phone, name: msm8937_64
brand: vivo, model: vivo 1807
build model list: vivo 1807
build id: OPM1.171019.026, version: 8.1.0 Oreo (OPM1.171019.026 release-keys)
build description: msm8937_64-user 8.1.0 OPM1.171019.026 eng.compil.20201103.204126 release-keys

crypto state: encrypted?
eMMC 5.x HEALTH report:
Device lifetime: Urgent (Consumed 90% of the reserved block)
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): 0% - 10% device life time used
Selected: [HYNIX] H9TQ52ACLTMCUR/64GB (BGA221)
any solution plees
 
Polatbay

Polatbay

Member
Jul 25, 2020
12
6
takhiatash
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x483B6EC4
Manufacturing date: янв 2019
CID: 90014A68 43386150 3E03483B 6EC41624
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 198738]
User area: 58.24 GiB(62,537,072,640 bytes)

eMMC 5.x Health report:
Device lifetime: Urgent (Consumed 90% of the reserved block)
Estimation of the device lifetime (SLC): Not defined
Estimation of the device lifetime (MLC): 10% - 20% device life time used
any solution plees
 
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